Materials Declaration Report: A1183LUA-T

Part Number: A1183LUA-T
Package Code: UA
Lead Count: 3
Plating: Sn
Package Weight: 0.10972 g
MSL Rating: *
*Through-hole devices not covered by J-STD-020.
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Leadframe
Substances weight % of material % of package
Misc. 0.00002691 g 0.03750 % 0.02452 %
Zirconium Zr 0.00006278 g 0.08750 % 0.05722 %
Copper Cu 0.07165731 g 99.87500 % 65.30925 %
Total: 0.07174700 g  
Encapsulation
Substances weight % of material % of package
2,6-Dibromo-4-(1-(3-bromo-4-hydroxyphenyl)-1-methy 0.00030747 g 1.11000 % 0.28023 %
Aluminum Al 0.00003490 g 0.12600 % 0.03181 %
Antimony/Antimony compounds Sb2O3 0.00000886 g 0.03200 % 0.00808 %
Epoxy cresol novolac resin 0.00713053 g 25.74200 % 6.49885 %
Silica, vitreous Si 0.02021823 g 72.99000 % 18.42711 %
Total: 0.02770000 g  
Die
Substances weight % of material % of package
Aluminum Al 0.00000008 g 0.40000 % 0.00007 %
Silicon Si 0.00001992 g 99.60000 % 0.01816 %
Total: 0.00002000 g  
Die Attach Adhesive
Substances weight % of material % of package
Silver Ag 0.00084000 g 70.00000 % 0.76559 %
Polyimide Pi 0.00036000 g 30.00000 % 0.32811 %
Total: 0.00120000 g  
Lead Finish
Substances weight % of material % of package
Misc. 0.00000085 g 0.01000 % 0.00077 %
Tin Sn 0.00849915 g 99.99000 % 7.74622 %
Total: 0.00850000 g  
Bonding Wire
Substances weight % of material % of package
Silver Ag 0.00000000 g 0.00290 % 0.00000 %
Gold Au 0.00010999 g 99.99323 % 0.10025 %
Misc. 0.00000000 g 0.00097 % 0.00000 %
Copper Cu 0.00000000 g 0.00290 % 0.00000 %
Total: 0.00011000 g  
Wafer/Die Coating
Substances weight % of material % of package
Misc. 0.00000030 g 0.10000 % 0.00027 %
Polyimide Pi 0.00029970 g 99.90000 % 0.27315 %
Total: 0.00030000 g  
Internal Leadframe Finish
Substances weight % of material % of package
Silver Ag 0.00014286 g 99.90000 % 0.13020 %
Sulfur S 0.00000007 g 0.05000 % 0.00007 %
Carbon C 0.00000007 g 0.05000 % 0.00007 %
Total: 0.00014300 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00011000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.050 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.050 ppm
Cadmium Cd   < 2 ppm < 0.002 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.050 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.050 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.002 ppm
Lead Pb   < 2 ppm < 0.002 ppm
Mercury Hg   < 2 ppm < 0.002 ppm
Polybrominated Biphenyls PBB   < 10 ppm < 0.010 ppm
Polybrominated Diphenyl Ethers PBDE   < 10 ppm < 0.010 ppm
Die
Substances 0.00002000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.009 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.009 ppm
Cadmium Cd   < 2 ppm < 0.000 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.009 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.009 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.000 ppm
Lead Pb   < 2 ppm < 0.000 ppm
Mercury Hg   < 2 ppm < 0.000 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.001 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.001 ppm
Die Attach Adhesive
Substances 0.00120000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.547 ppm
Bromine Br   < 50 ppm < 0.547 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.547 ppm
Cadmium Cd   < 2 ppm < 0.022 ppm
Chlorine Cl   < 50 ppm < 0.547 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.547 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.547 ppm
Flourine Fl   < 50 ppm < 0.547 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.022 ppm
Iodine I   < 50 ppm < 0.547 ppm
Lead Pb   < 2 ppm < 0.022 ppm
Mercury Hg   < 2 ppm < 0.022 ppm
Polybrominated Biphenyls PBB   < 50 ppm < 0.547 ppm
Polybrominated Diphenyl Ethers PBDE   < 50 ppm < 0.547 ppm
Encapsulation
Substances 0.02770000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   = 6130 ppm = 1547.585 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 12.623 ppm
Bromine Br   = 8320 ppm = 2100.474 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 12.623 ppm
Cadmium Cd   < 2 ppm < 0.505 ppm
Chlorine Cl   = 144 ppm = 36.354 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 12.623 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 12.623 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.505 ppm
Lead Pb   = 626 ppm = 158.041 ppm
Mercury Hg   < 2 ppm < 0.505 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.262 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.262 ppm
Internal Leadframe Finish
Substances 0.00014300 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 30 ppm < 0.039 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 30 ppm < 0.039 ppm
Cadmium Cd   < 2 ppm < 0.003 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 30 ppm < 0.039 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 30 ppm < 0.039 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.003 ppm
Lead Pb   < 2 ppm < 0.003 ppm
Mercury Hg   < 2 ppm < 0.003 ppm
Polybrominated Biphenyls PBB   < 2 ppm < 0.003 ppm
Polybrominated Diphenyl Ethers PBDE   < 2 ppm < 0.003 ppm
Lead Finish
Substances 0.00850000 g ppm w/avg ppm
Cadmium Cd   < 2 ppm < 0.155 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.155 ppm
Lead Pb   < 2 ppm < 0.155 ppm
Mercury Hg   < 2 ppm < 0.155 ppm
Polybrominated Biphenyls PBB   < 0.1 ppm < 0.008 ppm
Polybrominated Diphenyl Ethers PBDE   < 0.1 ppm < 0.008 ppm
Leadframe
Substances 0.07174700 g ppm w/avg ppm
Cadmium Cd   < 2 ppm < 1.308 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 1.308 ppm
Lead Pb   < 2 ppm < 1.308 ppm
Mercury Hg   < 2 ppm < 1.308 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 3.270 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 3.270 ppm
Wafer/Die Coating
Substances 0.00030000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.137 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.137 ppm
Cadmium Cd   < 2 ppm < 0.005 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.137 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.137 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.005 ppm
Lead Pb   < 2 ppm < 0.005 ppm
Mercury Hg   < 2 ppm < 0.005 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.014 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.014 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

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