Materials Declaration Report: A1232LLETR-T

Part Number: A1232LLETR-T
Package Code: LE
Lead Count: 8
Plating: Sn
Package Weight: 0.034111 g
MSL Rating: 2
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Leadframe
Substances weight % of material % of package
Iron Fe 0.00000868 g 0.10000 % 0.02546 %
Lead Pb 0.00000217 g 0.02500 % 0.00636 %
Magnesium Mg 0.00000434 g 0.05000 % 0.01273 %
Manganese Mn 0.00000087 g 0.01000 % 0.00255 %
Nickel Ni 0.00026049 g 3.00000 % 0.76365 %
Silicon Si 0.00003169 g 0.36500 % 0.09291 %
Zinc (metal) Zn 0.00002171 g 0.25000 % 0.06364 %
Copper Cu 0.00835305 g 96.20000 % 24.48783 %
Total: 0.00868300 g  
Encapsulation
Substances weight % of material % of package
Carbon black C 0.00007408 g 0.40000 % 0.21717 %
Fused silica SiO2 0.01498268 g 80.90000 % 43.92331 %
Misc. 0.00024076 g 1.30000 % 0.70581 %
Epoxy Resin / Basic Durometer EP 0.00142604 g 7.70000 % 4.18059 %
Metal oxide, hydroxide or salt ISO 1043-4 0.00092600 g 5.00000 % 2.71467 %
Phenolic Resin / Basic Duromer 0.00087044 g 4.70000 % 2.55179 %
Total: 0.01852000 g  
Die
Substances weight % of material % of package
Aluminum Al 0.00001178 g 0.40000 % 0.03455 %
Silicon Si 0.00293422 g 99.60000 % 8.60197 %
Total: 0.00294600 g  
Die Attach Adhesive
Substances weight % of material % of package
Silver Ag 0.00108800 g 80.00000 % 3.18959 %
Polyimide Pi 0.00027200 g 20.00000 % 0.79740 %
Total: 0.00136000 g  
Lead Finish
Substances weight % of material % of package
Misc. 0.00000008 g 0.01000 % 0.00023 %
Tin Sn 0.00079992 g 99.99000 % 2.34505 %
Total: 0.00080000 g  
Bonding Wire
Substances weight % of material % of package
Silver Ag 0.00000005 g 0.00290 % 0.00013 %
Gold Au 0.00155989 g 99.99323 % 4.57300 %
Misc. 0.00000002 g 0.00097 % 0.00004 %
Copper Cu 0.00000005 g 0.00290 % 0.00013 %
Total: 0.00156000 g  
Wafer/Die Coating
Substances weight % of material % of package
Misc. 0.00000007 g 0.10000 % 0.00019 %
Polyimide Pi 0.00006494 g 99.90000 % 0.19036 %
Total: 0.00006500 g  
Internal Leadframe Finish
Substances weight % of material % of package
Silver Ag 0.00017682 g 99.90000 % 0.51838 %
Sulfur S 0.00000009 g 0.05000 % 0.00026 %
Carbon C 0.00000009 g 0.05000 % 0.00026 %
Total: 0.00017700 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00156000 g ppm w/avg ppm
Beryllium Be   = 3 ppm = 0.137 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 0.003 ppm < 0.000 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 0.003 ppm < 0.000 ppm
Cadmium Cd   < 2 ppm < 0.091 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 0.003 ppm < 0.000 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 0.003 ppm < 0.000 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.091 ppm
Lead Pb   < 2 ppm < 0.091 ppm
Mercury Hg   < 2 ppm < 0.091 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.229 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.229 ppm
Die
Substances 0.00294600 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 4.318 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 4.318 ppm
Cadmium Cd   < 5 ppm < 0.432 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 4.318 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 4.318 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.173 ppm
Lead Pb   < 5 ppm < 0.432 ppm
Mercury Hg   < 2 ppm < 0.173 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.432 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.432 ppm
Die Attach Adhesive
Substances 0.00136000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 2 ppm < 0.080 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 1.993 ppm
Bromine Br   < 50 ppm < 1.993 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 1.993 ppm
Cadmium Cd   < 2 ppm < 0.080 ppm
Chlorine Cl   < 50 ppm < 1.993 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 1.993 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 1.993 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.080 ppm
Lead Pb   < 2 ppm < 0.080 ppm
Mercury Hg   < 2 ppm < 0.080 ppm
Polybrominated Biphenyls PBB   < 50 ppm < 1.993 ppm
Polybrominated Diphenyl Ethers PBDE   < 50 ppm < 1.993 ppm
Encapsulation
Substances 0.01852000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 2 ppm < 1.086 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 27.147 ppm
Bromine Br   < 50 ppm < 27.147 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 27.147 ppm
Cadmium Cd   < 2 ppm < 1.086 ppm
Chlorine Cl   < 50 ppm < 27.147 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 27.147 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 27.147 ppm
Flourine Fl   < 50 ppm < 27.147 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 1.086 ppm
Iodine I   < 50 ppm < 27.147 ppm
Lead Pb   < 2 ppm < 1.086 ppm
Mercury Hg   < 2 ppm < 1.086 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 2.715 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 2.715 ppm
Internal Leadframe Finish
Substances 0.00017700 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 30 ppm < 0.156 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 30 ppm < 0.156 ppm
Cadmium Cd   < 2 ppm < 0.010 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 30 ppm < 0.156 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 30 ppm < 0.156 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.010 ppm
Lead Pb   = 5 ppm = 0.026 ppm
Mercury Hg   < 2 ppm < 0.010 ppm
Polybrominated Biphenyls PBB   < 2 ppm < 0.010 ppm
Polybrominated Diphenyl Ethers PBDE   < 2 ppm < 0.010 ppm
Lead Finish
Substances 0.00080000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 1.173 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 1.173 ppm
Cadmium Cd   < 2 ppm < 0.047 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 1.173 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 1.173 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.047 ppm
Lead Pb   = 39 ppm = 0.915 ppm
Mercury Hg   < 2 ppm < 0.047 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.117 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.117 ppm
Leadframe
Substances 0.00868300 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 12.728 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 12.728 ppm
Cadmium Cd   < 2 ppm < 0.509 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 12.728 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 12.728 ppm
Hexavalent Chromium Cr+6   < 0.1 ppm < 0.025 ppm
Lead Pb   < 2 ppm < 0.509 ppm
Mercury Hg   < 2 ppm < 0.509 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.273 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.273 ppm
Wafer/Die Coating
Substances 0.00006500 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.095 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.095 ppm
Cadmium Cd   < 2 ppm < 0.004 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.095 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.095 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.004 ppm
Lead Pb   < 2 ppm < 0.004 ppm
Mercury Hg   < 2 ppm < 0.004 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.010 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.010 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

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