Materials Declaration Report: A1333LLPTR-DD-T

Part Number: A1333LLPTR-DD-T
Package Code: LP
Lead Count: 24
Plating: Sn
Package Weight: 0.10823 g
MSL Rating: 2
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Leadframe
Substances weight % of material % of package
Iron Fe 0.00058750 g 2.35000 % 0.54283 %
Lead Pb 0.00000021 g 0.00082 % 0.00019 %
Phosphorus (wht/yellow) P 0.00002050 g 0.08200 % 0.01894 %
Zinc (metal) Zn 0.00004375 g 0.17500 % 0.04042 %
Copper Cu 0.02434805 g 97.39218 % 22.49658 %
Total: 0.02500000 g  
Encapsulation
Substances weight % of material % of package
Aluminum Al 0.00002790 g 0.04100 % 0.02578 %
Epoxy cresol novolac resin 0.00686625 g 10.09000 % 6.34412 %
Magnesium Mg 0.00004832 g 0.07100 % 0.04464 %
Silica, vitreous Si 0.06110345 g 89.79200 % 56.45704 %
Zinc (metal) Zn 0.00000408 g 0.00600 % 0.00377 %
Total: 0.06805000 g  
Die
Substances weight % of material % of package
Aluminum Al 0.00003536 g 0.40000 % 0.03267 %
Silicon Si 0.00880464 g 99.60000 % 8.13512 %
Total: 0.00884000 g  
Die Attach Adhesive
Substances weight % of material % of package
Silver Ag 0.00165640 g 82.00000 % 1.53044 %
Polyimide Pi 0.00036360 g 18.00000 % 0.33595 %
Total: 0.00202000 g  
Lead Finish
Substances weight % of material % of package
Misc. 0.00000019 g 0.01000 % 0.00018 %
Tin Sn 0.00193981 g 99.99000 % 1.79230 %
Total: 0.00194000 g  
Bonding Wire
Substances weight % of material % of package
Silver Ag 0.00000006 g 0.00290 % 0.00005 %
Gold Au 0.00199987 g 99.99323 % 1.84779 %
Misc. 0.00000002 g 0.00097 % 0.00002 %
Copper Cu 0.00000006 g 0.00290 % 0.00005 %
Total: 0.00200000 g  
Internal Leadframe Finish
Substances weight % of material % of package
Silver Ag 0.00037962 g 99.90000 % 0.35075 %
Sulfur S 0.00000019 g 0.05000 % 0.00018 %
Carbon C 0.00000019 g 0.05000 % 0.00018 %
Total: 0.00038000 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00200000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.924 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.924 ppm
Cadmium Cd   < 2 ppm < 0.037 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.924 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.924 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.037 ppm
Lead Pb   < 2 ppm < 0.037 ppm
Mercury Hg   < 2 ppm < 0.037 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.092 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.092 ppm
Die
Substances 0.00884000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 4.084 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 4.084 ppm
Cadmium Cd   < 2 ppm < 0.163 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 4.084 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 4.084 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.163 ppm
Lead Pb   < 2 ppm < 0.163 ppm
Mercury Hg   < 2 ppm < 0.163 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.408 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.408 ppm
Die Attach Adhesive
Substances 0.00202000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.933 ppm
Bromine Br   < 50 ppm < 0.933 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.933 ppm
Cadmium Cd   < 2 ppm < 0.037 ppm
Chlorine Cl   < 50 ppm < 0.933 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.933 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.933 ppm
Flourine Fl   < 50 ppm < 0.933 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.037 ppm
Iodine I   < 50 ppm < 0.933 ppm
Lead Pb   < 2 ppm < 0.037 ppm
Mercury Hg   < 2 ppm < 0.037 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.093 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.093 ppm
Encapsulation
Substances 0.06805000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 2 ppm < 1.258 ppm
Bromine Br   < 50 ppm < 31.438 ppm
Cadmium Cd   < 2 ppm < 1.258 ppm
Chlorine Cl   < 50 ppm < 31.438 ppm
Flourine Fl   < 50 ppm < 31.438 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 1.258 ppm
Iodine I   < 50 ppm < 31.438 ppm
Lead Pb   < 2 ppm < 1.258 ppm
Mercury Hg   < 2 ppm < 1.258 ppm
PFOA PFOA   < 10 ppm < 6.288 ppm
PFOS PFOS   < 10 ppm < 6.288 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 3.144 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 3.144 ppm
Internal Leadframe Finish
Substances 0.00038000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.176 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.176 ppm
Cadmium Cd   < 2 ppm < 0.007 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.176 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.176 ppm
Hexavalent Chromium Cr+6   < 0.1 ppm < 0.000 ppm
Lead Pb   < 2 ppm < 0.007 ppm
Mercury Hg   < 2 ppm < 0.007 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.018 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.018 ppm
Lead Finish
Substances 0.00194000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 0.005 ppm < 0.000 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 0.005 ppm < 0.000 ppm
Cadmium Cd   < 2 ppm < 0.036 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 0.005 ppm < 0.000 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 0.005 ppm < 0.000 ppm
Hexavalent Chromium Cr+6   < 0.1 ppm < 0.002 ppm
Lead Pb   = 66 ppm = 1.183 ppm
Mercury Hg   < 2 ppm < 0.036 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.090 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.090 ppm
Leadframe
Substances 0.02500000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 11.549 ppm
Bromine Br   < 5 ppm < 1.155 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 11.549 ppm
Cadmium Cd   < 1 ppm < 0.231 ppm
Chlorine Cl   = 6 ppm = 1.386 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 11.549 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 11.549 ppm
Hexavalent Chromium Cr+6   < 1 ppm < 0.231 ppm
Lead Pb   = 22 ppm = 5.082 ppm
Mercury Hg   < 2 ppm < 0.462 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.155 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.155 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

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