Materials Declaration Report: A1362LKTTN-T

Part Number: A1362LKTTN-T
Package Code: KT
Lead Count: 4
Plating: Sn
Package Weight: 0.09875 g
MSL Rating: *
*Through-hole devices not covered by J-STD-020.
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Leadframe
Substances weight % of material % of package
Misc. 0.00001927 g 0.03750 % 0.01951 %
Zirconium Zr 0.00004496 g 0.08750 % 0.04552 %
Copper Cu 0.05131378 g 99.87500 % 51.96331 %
Total: 0.05137800 g  
Encapsulation
Substances weight % of material % of package
Carbon black C 0.00015708 g 0.40000 % 0.15907 %
Fused silica SiO2 0.03176943 g 80.90000 % 32.17157 %
Misc. 0.00051051 g 1.30000 % 0.51697 %
Epoxy Resin / Basic Durometer EP 0.00302379 g 7.70000 % 3.06207 %
Metal oxide, hydroxide or salt ISO 1043-4 0.00196350 g 5.00000 % 1.98835 %
Phenolic Resin / Basic Duromer 0.00184569 g 4.70000 % 1.86905 %
Total: 0.03927000 g  
Die
Substances weight % of material % of package
Aluminum Al 0.00000080 g 0.40000 % 0.00081 %
Silicon Si 0.00019920 g 99.60000 % 0.20172 %
Total: 0.00020000 g  
Die Attach Adhesive
Substances weight % of material % of package
Silver Ag 0.00091440 g 76.20000 % 0.92597 %
Polyimide Pi 0.00028560 g 23.80000 % 0.28922 %
Total: 0.00120000 g  
Lead Finish
Substances weight % of material % of package
Misc. 0.00000062 g 0.01000 % 0.00063 %
Tin Sn 0.00619938 g 99.99000 % 6.27785 %
Total: 0.00620000 g  
Bonding Wire
Substances weight % of material % of package
Silver Ag 0.00000001 g 0.00290 % 0.00001 %
Gold Au 0.00019999 g 99.99323 % 0.20252 %
Misc. 0.00000000 g 0.00097 % 0.00000 %
Copper Cu 0.00000001 g 0.00290 % 0.00001 %
Total: 0.00020000 g  
Wafer/Die Coating
Substances weight % of material % of package
Misc. 0.00000020 g 0.10000 % 0.00020 %
Polyimide Pi 0.00019980 g 99.90000 % 0.20233 %
Total: 0.00020000 g  
Internal Leadframe Finish
Substances weight % of material % of package
Silver Ag 0.00010190 g 99.90000 % 0.10319 %
Sulfur S 0.00000005 g 0.05000 % 0.00005 %
Carbon C 0.00000005 g 0.05000 % 0.00005 %
Total: 0.00010200 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00020000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.101 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.101 ppm
Cadmium Cd   < 2 ppm < 0.004 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.101 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.101 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.004 ppm
Lead Pb   < 2 ppm < 0.004 ppm
Mercury Hg   < 2 ppm < 0.004 ppm
Polybrominated Biphenyls PBB   < 10 ppm < 0.020 ppm
Polybrominated Diphenyl Ethers PBDE   < 10 ppm < 0.020 ppm
Die
Substances 0.00020000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.101 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.101 ppm
Cadmium Cd   < 2 ppm < 0.004 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.101 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.101 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.004 ppm
Lead Pb   < 2 ppm < 0.004 ppm
Mercury Hg   < 2 ppm < 0.004 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.010 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.010 ppm
Die Attach Adhesive
Substances 0.00120000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 2 ppm < 0.024 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.608 ppm
Bromine Br   < 50 ppm < 0.608 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.608 ppm
Cadmium Cd   < 2 ppm < 0.024 ppm
Chlorine Cl   < 50 ppm < 0.608 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.608 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.608 ppm
Flourine Fl   < 50 ppm < 0.608 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.024 ppm
Iodine I   < 50 ppm < 0.608 ppm
Lead Pb   < 2 ppm < 0.024 ppm
Mercury Hg   < 2 ppm < 0.024 ppm
PFOA PFOA   < 10 ppm < 0.122 ppm
PFOS PFOS   < 10 ppm < 0.122 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.061 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.061 ppm
Encapsulation
Substances 0.03927000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 2 ppm < 0.795 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 19.884 ppm
Bromine Br   < 50 ppm < 19.884 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 19.884 ppm
Cadmium Cd   < 2 ppm < 0.795 ppm
Chlorine Cl   < 50 ppm < 19.884 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 19.884 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 19.884 ppm
Flourine Fl   < 50 ppm < 19.884 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.795 ppm
Iodine I   < 50 ppm < 19.884 ppm
Lead Pb   < 2 ppm < 0.795 ppm
Mercury Hg   < 2 ppm < 0.795 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.988 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.988 ppm
Internal Leadframe Finish
Substances 0.00010200 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 30 ppm < 0.031 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 30 ppm < 0.031 ppm
Cadmium Cd   < 2 ppm < 0.002 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 30 ppm < 0.031 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 30 ppm < 0.031 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.002 ppm
Lead Pb   < 2 ppm < 0.002 ppm
Mercury Hg   < 2 ppm < 0.002 ppm
Polybrominated Biphenyls PBB   < 2 ppm < 0.002 ppm
Polybrominated Diphenyl Ethers PBDE   < 2 ppm < 0.002 ppm
Lead Finish
Substances 0.00620000 g ppm w/avg ppm
Cadmium Cd   < 2 ppm < 0.126 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.126 ppm
Lead Pb   < 2 ppm < 0.126 ppm
Mercury Hg   < 2 ppm < 0.126 ppm
Polybrominated Biphenyls PBB   < 0.1 ppm < 0.006 ppm
Polybrominated Diphenyl Ethers PBDE   < 0.1 ppm < 0.006 ppm
Leadframe
Substances 0.05137800 g ppm w/avg ppm
Cadmium Cd   < 2 ppm < 1.041 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 1.041 ppm
Lead Pb   < 2 ppm < 1.041 ppm
Mercury Hg   < 2 ppm < 1.041 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 2.601 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 2.601 ppm
Wafer/Die Coating
Substances 0.00020000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.101 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.101 ppm
Cadmium Cd   < 2 ppm < 0.004 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.101 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.101 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.004 ppm
Lead Pb   < 2 ppm < 0.004 ppm
Mercury Hg   < 2 ppm < 0.004 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.010 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.010 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

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