Materials Declaration Report: A3211EEHLT-T

Part Number: A3211EEHLT-T
Package Code: EH
Lead Count: 6
Plating: Sn
Package Weight: 0.01364 g
MSL Rating: 1
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Leadframe
Substances weight % of material % of package
Iron Fe 0.00010810 g 2.35000 % 0.79252 %
Lead Pb 0.00000004 g 0.00082 % 0.00028 %
Phosphorus (wht/yellow) P 0.00000377 g 0.08200 % 0.02765 %
Zinc (metal) Zn 0.00000805 g 0.17500 % 0.05902 %
Copper Cu 0.00448004 g 97.39218 % 32.84487 %
Total: 0.00460000 g  
Encapsulation
Substances weight % of material % of package
Antimony Trioxide Sb2O3 0.00004230 g 0.50000 % 0.31012 %
Carbon black C 0.00002538 g 0.30000 % 0.18607 %
Epoxy resin EP 0.00059220 g 7.00000 % 4.34164 %
Fused silica SiO2 0.00745749 g 88.15000 % 54.67368 %
Phenol, 4,4'-(1-methylethylidene)bis(2,6-dibromo-, 0.00004653 g 0.55000 % 0.34113 %
Phenolic Resin 0.00029610 g 3.50000 % 2.17082 %
Total: 0.00846000 g  
Die
Substances weight % of material % of package
Aluminum Al 0.00000140 g 0.40000 % 0.01026 %
Silicon Si 0.00034860 g 99.60000 % 2.55572 %
Total: 0.00035000 g  
Die Attach Adhesive
Substances weight % of material % of package
Silver Ag 0.00002100 g 70.00000 % 0.15396 %
Polyimide Pi 0.00000900 g 30.00000 % 0.06598 %
Total: 0.00003000 g  
Lead Finish
Substances weight % of material % of package
Misc. 0.00000001 g 0.01000 % 0.00007 %
Tin Sn 0.00008999 g 99.99000 % 0.65976 %
Total: 0.00009000 g  
Bonding Wire
Substances weight % of material % of package
Silver Ag 0.00000000 g 0.00290 % 0.00001 %
Gold Au 0.00004000 g 99.99323 % 0.29324 %
Misc. 0.00000000 g 0.00097 % 0.00000 %
Copper Cu 0.00000000 g 0.00290 % 0.00001 %
Total: 0.00004000 g  
Internal Leadframe Finish
Substances weight % of material % of package
Silver Ag 0.00006993 g 99.90000 % 0.51268 %
Sulfur S 0.00000004 g 0.05000 % 0.00026 %
Carbon C 0.00000004 g 0.05000 % 0.00026 %
Total: 0.00007000 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00004000 g ppm w/avg ppm
Beryllium Be   = 3 ppm = 0.009 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 0.003 ppm < 0.000 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 0.003 ppm < 0.000 ppm
Cadmium Cd   < 2 ppm < 0.006 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 0.003 ppm < 0.000 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 0.003 ppm < 0.000 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.006 ppm
Lead Pb   < 2 ppm < 0.006 ppm
Mercury Hg   < 2 ppm < 0.006 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.015 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.015 ppm
Die
Substances 0.00035000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 1.283 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 1.283 ppm
Cadmium Cd   < 5 ppm < 0.128 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 1.283 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 1.283 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.051 ppm
Lead Pb   < 5 ppm < 0.128 ppm
Mercury Hg   < 2 ppm < 0.051 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.128 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.128 ppm
Die Attach Adhesive
Substances 0.00003000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.110 ppm
Bromine Br   < 50 ppm < 0.110 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.110 ppm
Cadmium Cd   < 2 ppm < 0.004 ppm
Chlorine Cl   = 78.6 ppm = 0.173 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.110 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.110 ppm
Flourine Fl   < 50 ppm < 0.110 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.004 ppm
Iodine I   < 50 ppm < 0.110 ppm
Lead Pb   < 2 ppm < 0.004 ppm
Mercury Hg   < 2 ppm < 0.004 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.011 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.011 ppm
Encapsulation
Substances 0.00846000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 31.012 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 31.012 ppm
Cadmium Cd   < 2 ppm < 1.240 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 31.012 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 31.012 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 1.240 ppm
Lead Pb   < 2 ppm < 1.240 ppm
Mercury Hg   < 2 ppm < 1.240 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 3.101 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 3.101 ppm
Internal Leadframe Finish
Substances 0.00007000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 30 ppm < 0.154 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 30 ppm < 0.154 ppm
Cadmium Cd   < 2 ppm < 0.010 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 30 ppm < 0.154 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 30 ppm < 0.154 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.010 ppm
Lead Pb   = 5 ppm = 0.026 ppm
Mercury Hg   < 2 ppm < 0.010 ppm
Polybrominated Biphenyls PBB   < 2 ppm < 0.010 ppm
Polybrominated Diphenyl Ethers PBDE   < 2 ppm < 0.010 ppm
Lead Finish
Substances 0.00009000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.330 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.330 ppm
Cadmium Cd   < 2 ppm < 0.013 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.330 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.330 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.013 ppm
Lead Pb   = 39 ppm = 0.257 ppm
Mercury Hg   < 2 ppm < 0.013 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.033 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.033 ppm
Leadframe
Substances 0.00460000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 16.862 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 16.862 ppm
Cadmium Cd   < 2 ppm < 0.674 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 16.862 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 16.862 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.674 ppm
Lead Pb   = 13 ppm = 4.384 ppm
Mercury Hg   < 2 ppm < 0.674 ppm
PFOA PFOA   < 1 ppm < 0.337 ppm
PFOS PFOS   < 1 ppm < 0.337 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.686 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.686 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

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