Materials Declaration Report: A4933KJP-T
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Part Number:
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A4933KJP-T
|
|
Package Code:
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JP
|
|
Lead Count:
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48
|
|
Plating:
|
Sn
|
|
Package Weight:
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0.1855 g
|
|
MSL Rating:
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2
|
|
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Composition Details
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Bonding Wire
|
| Substances |
weight |
% of material |
% of package |
| Gold |
Au |
0.00400000 g |
99.99992 % |
2.15633 % |
| Misc. |
|
0.00000000 g |
0.00008 % |
0.00000 % |
| Total: |
0.00400000 g |
|
|
Die
|
| Substances |
weight |
% of material |
% of package |
| Aluminum |
Al |
0.00004000 g |
1.00000 % |
0.02156 % |
| Silicon |
Si |
0.00396000 g |
99.00000 % |
2.13477 % |
| Total: |
0.00400000 g |
|
|
Die Attach Adhesive
|
| Substances |
weight |
% of material |
% of package |
| Silver |
Ag |
0.00106600 g |
82.00000 % |
0.57466 % |
| Polyimide |
|
0.00023400 g |
18.00000 % |
0.12615 % |
| Total: |
0.00130000 g |
|
|
Encapsulation
|
| Substances |
weight |
% of material |
% of package |
| Carbon black |
C |
0.00032400 g |
0.30000 % |
0.17466 % |
| Epoxy resin |
EP |
0.00810000 g |
7.50000 % |
4.36658 % |
| Phenolic Resin |
|
0.00540000 g |
5.00000 % |
2.91105 % |
| Silica, vitreous |
Si |
0.09417600 g |
87.20000 % |
50.76873 % |
| Total: |
0.10800000 g |
|
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Lead Finish
|
| Substances |
weight |
% of material |
% of package |
| Misc. |
|
0.00000012 g |
0.01000 % |
0.00006 % |
| Tin |
Sn |
0.00119988 g |
99.99000 % |
0.64684 % |
| Total: |
0.00120000 g |
|
|
Lead Frame
|
| Substances |
weight |
% of material |
% of package |
| Silver |
Ag |
0.00100500 g |
1.50000 % |
0.54178 % |
| Copper |
Cu |
0.06344900 g |
94.70000 % |
34.20431 % |
| Iron |
Fe |
0.00006700 g |
0.10000 % |
0.03612 % |
| Lead |
Pb |
0.00001675 g |
0.02500 % |
0.00903 % |
| Magnesium |
Mg |
0.00003350 g |
0.05000 % |
0.01806 % |
| Manganese |
Mn |
0.00000670 g |
0.01000 % |
0.00361 % |
| Nickel |
Ni |
0.00201000 g |
3.00000 % |
1.08356 % |
| Silicon |
Si |
0.00024455 g |
0.36500 % |
0.13183 % |
| Zinc (metal) |
Zn |
0.00016750 g |
0.25000 % |
0.09030 % |
| Total: |
0.06700000 g |
|
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For information on "Green" molding compounds, please contact your local sales representative.
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RoHS and other substances of concern
| Bonding Wire |
| Substances |
0.00400000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.043 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.043 ppm |
| Lead |
Pb |
|
< 2 ppm |
< 0.043 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.043 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.108 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.108 ppm |
| Die |
| Substances |
0.00400000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 5 ppm |
< 0.108 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.043 ppm |
| Lead |
Pb |
|
< 5 ppm |
< 0.108 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.043 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.108 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.108 ppm |
| Die Attach Adhesive |
| Substances |
0.00130000 g |
ppm |
w/avg ppm |
| Antimony Trioxide |
Sb2O3 |
|
< 10 ppm |
< 0.070 ppm |
| Bromine |
Br |
|
< 30 ppm |
< 0.210 ppm |
| Cadmium |
Cd |
|
< 1 ppm |
< 0.007 ppm |
| Chlorine |
Cl |
|
= 143 ppm |
= 1.002 ppm |
| Flourine |
Fl |
|
< 30 ppm |
< 0.210 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 1 ppm |
< 0.007 ppm |
| Iodine |
I |
|
< 50 ppm |
< 0.350 ppm |
| Lead |
Pb |
|
< 5 ppm |
< 0.035 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.014 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.035 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.035 ppm |
| Lead Finish |
| Substances |
0.00120000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.013 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.013 ppm |
| Lead |
Pb |
|
= 7 ppm |
= 0.045 ppm |
| Mercury |
Hg |
|
< 2 ppm |
< 0.013 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 0.032 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
< 5 ppm |
< 0.032 ppm |
| Lead Frame |
| Substances |
0.06700000 g |
ppm |
w/avg ppm |
| Cadmium |
Cd |
|
< 2 ppm |
< 0.722 ppm |
| Hexavalent Chromium |
Cr+6 |
|
< 2 ppm |
< 0.722 ppm |
| Lead |
Pb |
|
= 2 ppm |
= 0.722 ppm |
| Mercury |
Hg |
|
= 2 ppm |
= 0.722 ppm |
| Nickel |
Ni |
|
= 30000 ppm |
= 10835.580 ppm |
| Polybrominated Biphenyls |
PBB |
|
< 5 ppm |
< 1.806 ppm |
| Polybrominated Diphenyl Ethers |
PBDE |
|
= 5 ppm |
= 1.806 ppm |
|
The less than (<) symbol is used to indicate that the test results are below
the amounts indicated, which are the minimum detection limits of the laboratory
performing the testing. The exception to this is for plating containing lead, where
the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if
solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants,
Nickel.
Weighted average = for part as a whole.
The information included herein is believed to be accurate and reliable. However,
Allegro MicroSystems, Inc. assumes no responsibility for its use. The user is cautioned
to verify that the information being relied upon is current.
|
As a supplier of components, we are not required to assess regulatory requirements (such as the
European RoHS Directive (2003/95/EC) - hereinafter referred to as RoHS) that apply to finished
product. Please note further that product may contain small amounts of lead. Therefore, we cannot
make representations, warranties or indemnities regarding the complete absence of lead in the finished product.
You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable
thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.
Allegro MicroSystems, Inc. is a cooperative environmental supplier who fully supports global environmental initiatives.
We value our customer relationships and are committed to provide the highest levels of quality standards.
Geoffrey H. DesRosiers
Quality Systems Specialist