Materials Declaration Report: A4933KJP-T

Part Number: A4933KJP-T
Package Code: JP
Lead Count: 48
Plating: Sn
Package Weight: 0.1855 g
MSL Rating: 2
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Leadframe
Substances weight % of material % of package
Iron Fe 0.00006600 g 0.10000 % 0.03558 %
Lead Pb 0.00001650 g 0.02500 % 0.00889 %
Magnesium Mg 0.00003300 g 0.05000 % 0.01779 %
Manganese Mn 0.00000660 g 0.01000 % 0.00356 %
Nickel Ni 0.00197985 g 3.00000 % 1.06731 %
Silicon Si 0.00024088 g 0.36500 % 0.12986 %
Zinc (metal) Zn 0.00016499 g 0.25000 % 0.08894 %
Copper Cu 0.06348719 g 96.20000 % 34.22490 %
Total: 0.06599500 g  
Encapsulation
Substances weight % of material % of package
Carbon black C 0.00032400 g 0.30000 % 0.17466 %
Epoxy resin EP 0.00810000 g 7.50000 % 4.36658 %
Phenolic Resin 0.00540000 g 5.00000 % 2.91105 %
Silica, vitreous Si 0.09417600 g 87.20000 % 50.76873 %
Total: 0.10800000 g  
Die
Substances weight % of material % of package
Aluminum Al 0.00001600 g 0.40000 % 0.00863 %
Silicon Si 0.00398400 g 99.60000 % 2.14771 %
Total: 0.00400000 g  
Die Attach Adhesive
Substances weight % of material % of package
Silver Ag 0.00106600 g 82.00000 % 0.57466 %
Polyimide Pi 0.00023400 g 18.00000 % 0.12615 %
Total: 0.00130000 g  
Lead Finish
Substances weight % of material % of package
Misc. 0.00000012 g 0.01000 % 0.00006 %
Tin Sn 0.00119988 g 99.99000 % 0.64684 %
Total: 0.00120000 g  
Bonding Wire
Substances weight % of material % of package
Silver Ag 0.00000012 g 0.00290 % 0.00006 %
Gold Au 0.00399973 g 99.99323 % 2.15619 %
Misc. 0.00000004 g 0.00097 % 0.00002 %
Copper Cu 0.00000012 g 0.00290 % 0.00006 %
Total: 0.00400000 g  
Internal Leadframe Finish
Substances weight % of material % of package
Silver Ag 0.00100400 g 99.90000 % 0.54124 %
Sulfur S 0.00000050 g 0.05000 % 0.00027 %
Carbon C 0.00000050 g 0.05000 % 0.00027 %
Total: 0.00100500 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00400000 g ppm w/avg ppm
Beryllium Be   = 3 ppm = 0.065 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 0.003 ppm < 0.000 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 0.003 ppm < 0.000 ppm
Cadmium Cd   < 2 ppm < 0.043 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 0.003 ppm < 0.000 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 0.003 ppm < 0.000 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.043 ppm
Lead Pb   < 2 ppm < 0.043 ppm
Mercury Hg   < 2 ppm < 0.043 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.108 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.108 ppm
Die
Substances 0.00400000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 1.078 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 1.078 ppm
Cadmium Cd   < 5 ppm < 0.108 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 1.078 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 1.078 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.043 ppm
Lead Pb   < 5 ppm < 0.108 ppm
Mercury Hg   < 2 ppm < 0.043 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.108 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.108 ppm
Die Attach Adhesive
Substances 0.00130000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 10 ppm < 0.070 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.350 ppm
Bromine Br   < 50 ppm < 0.350 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.350 ppm
Cadmium Cd   < 2 ppm < 0.014 ppm
Chlorine Cl   < 50 ppm < 0.350 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.350 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.350 ppm
Flourine Fl   < 50 ppm < 0.350 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.014 ppm
Iodine I   < 50 ppm < 0.350 ppm
Lead Pb   < 2 ppm < 0.014 ppm
Mercury Hg   < 2 ppm < 0.014 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.035 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.035 ppm
Internal Leadframe Finish
Substances 0.00100500 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 30 ppm < 0.163 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 30 ppm < 0.163 ppm
Cadmium Cd   < 2 ppm < 0.011 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 30 ppm < 0.163 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 30 ppm < 0.163 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.011 ppm
Lead Pb   = 5 ppm = 0.027 ppm
Mercury Hg   < 2 ppm < 0.011 ppm
Polybrominated Biphenyls PBB   < 2 ppm < 0.011 ppm
Polybrominated Diphenyl Ethers PBDE   < 2 ppm < 0.011 ppm
Lead Finish
Substances 0.00120000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.323 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.323 ppm
Cadmium Cd   < 2 ppm < 0.013 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.323 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.323 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.013 ppm
Lead Pb   = 39 ppm = 0.252 ppm
Mercury Hg   < 2 ppm < 0.013 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.032 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.032 ppm
Leadframe
Substances 0.06599500 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 17.788 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 17.788 ppm
Cadmium Cd   < 2 ppm < 0.712 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 17.788 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 17.788 ppm
Hexavalent Chromium Cr+6   < 0.1 ppm < 0.036 ppm
Lead Pb   < 2 ppm < 0.712 ppm
Mercury Hg   < 2 ppm < 0.712 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.779 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.779 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

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