Materials Declaration Report: A4964KJPTR-T

Part Number: A4964KJPTR-T
Package Code: JP
Lead Count: 32
Plating: Sn
Package Weight: 0.17675 g
MSL Rating: 2
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Leadframe
Substances weight % of material % of package
Silver Ag 0.00084675 g 1.50000 % 0.47907 %
Iron Fe 0.00005645 g 0.10000 % 0.03194 %
Lead Pb 0.00001411 g 0.02500 % 0.00798 %
Magnesium Mg 0.00002823 g 0.05000 % 0.01597 %
Manganese Mn 0.00000565 g 0.01000 % 0.00319 %
Nickel Ni 0.00169350 g 3.00000 % 0.95813 %
Silicon Si 0.00020604 g 0.36500 % 0.11657 %
Zinc (metal) Zn 0.00014113 g 0.25000 % 0.07984 %
Copper Cu 0.05345815 g 94.70000 % 30.24506 %
Total: 0.05645000 g  
Encapsulation
Substances weight % of material % of package
Carbon black C 0.00043860 g 0.40000 % 0.24815 %
Fused silica SiO2 0.08870685 g 80.90000 % 50.18776 %
Misc. 0.00142545 g 1.30000 % 0.80648 %
Epoxy Resin / Basic Durometer EP 0.00844305 g 7.70000 % 4.77683 %
Metal oxide, hydroxide or salt ISO 1043-4 0.00548250 g 5.00000 % 3.10184 %
Phenolic Resin / Basic Duromer 0.00515355 g 4.70000 % 2.91573 %
Total: 0.10965000 g  
Die
Substances weight % of material % of package
Aluminum Al 0.00001440 g 0.40000 % 0.00815 %
Silicon Si 0.00358560 g 99.60000 % 2.02863 %
Total: 0.00360000 g  
Die Attach Adhesive
Substances weight % of material % of package
Silver Ag 0.00160720 g 82.00000 % 0.90931 %
Polyimide Pi 0.00035280 g 18.00000 % 0.19960 %
Total: 0.00196000 g  
Lead Finish
Substances weight % of material % of package
Misc. 0.00002650 g 1.00000 % 0.01499 %
Tin Sn 0.00262350 g 99.00000 % 1.48430 %
Total: 0.00265000 g  
Bonding Wire
Substances weight % of material % of package
Silver Ag 0.00000007 g 0.00290 % 0.00004 %
Gold Au 0.00243984 g 99.99323 % 1.38039 %
Misc. 0.00000002 g 0.00097 % 0.00001 %
Copper Cu 0.00000007 g 0.00290 % 0.00004 %
Total: 0.00244000 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00244000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 2 ppm < 0.028 ppm
Bromine Br   < 50 ppm < 0.690 ppm
Cadmium Cd   < 2 ppm < 0.028 ppm
Chlorine Cl   < 50 ppm < 0.690 ppm
Flourine Fl   < 50 ppm < 0.690 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.028 ppm
Iodine I   < 50 ppm < 0.690 ppm
Lead Pb   < 2 ppm < 0.028 ppm
Mercury Hg   < 2 ppm < 0.028 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.069 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.069 ppm
Tetrabromobisphenol A TBBPA   < 5 ppm < 0.069 ppm
Die
Substances 0.00360000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 1.018 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 1.018 ppm
Cadmium Cd   < 2 ppm < 0.041 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 1.018 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 1.018 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.041 ppm
Lead Pb   < 2 ppm < 0.041 ppm
Mercury Hg   < 2 ppm < 0.041 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.102 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.102 ppm
Encapsulation
Substances 0.10965000 g ppm w/avg ppm
Cadmium Cd   < 2 ppm < 1.241 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 1.241 ppm
Lead Pb   < 2 ppm < 1.241 ppm
Mercury Hg   < 2 ppm < 1.241 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 3.102 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 3.102 ppm
Lead Finish
Substances 0.00265000 g ppm w/avg ppm
Cadmium Cd   < 5 ppm < 0.075 ppm
Hexavalent Chromium Cr+6   < 5 ppm < 0.075 ppm
Lead Pb   = 18 ppm = 0.270 ppm
Mercury Hg   < 1 ppm < 0.015 ppm
Polybrominated Biphenyls PBB   < 10 ppm < 0.150 ppm
Polybrominated Diphenyl Ethers PBDE   < 10 ppm < 0.150 ppm
Leadframe
Substances 0.05645000 g ppm w/avg ppm
Cadmium Cd   < 2 ppm < 0.639 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.639 ppm
Lead Pb   < 2 ppm < 0.639 ppm
Mercury Hg   < 2 ppm < 0.639 ppm
Nickel Ni   = 30000 ppm = 9581.329 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.597 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.597 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

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