Materials Declaration Report: ACS781LLRTR-050B-T

Part Number: ACS781LLRTR-050B-T
Package Code: LR
Lead Count: 7
Bump Count: 6
Plating: Sn
Package Weight: 0.123821 g
MSL Rating: 3
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Leadframe
Substances weight % of material % of package
Misc. 0.00001800 g 0.03750 % 0.01454 %
Zirconium Zr 0.00004200 g 0.08750 % 0.03392 %
Copper Cu 0.04794000 g 99.87500 % 38.71718 %
Total: 0.04800000 g  
Encapsulation
Substances weight % of material % of package
Carbon black C 0.00037471 g 0.52174 % 0.30262 %
Silica, vitreous Si 0.05761213 g 80.21739 % 46.52856 %
Epoxy Resin / Basic Durometer EP 0.00471514 g 6.56522 % 3.80803 %
Phenol Resin 0.00256054 g 3.56522 % 2.06794 %
Silicon Dioxide O2Si 0.00471514 g 6.56522 % 3.80803 %
Metal oxide, hydroxide or salt ISO 1043-4 0.00184234 g 2.56522 % 1.48791 %
Total: 0.07182000 g  
Die
Substances weight % of material % of package
Aluminum Al 0.00001360 g 0.40000 % 0.01098 %
Silicon Si 0.00338640 g 99.60000 % 2.73492 %
Total: 0.00340000 g  
Die Attach Adhesive
Substances weight % of material % of package
Crystalline silica SiO2 0.00001566 g 54.00000 % 0.01265 %
Epoxy cresol novolac resin 0.00000305 g 10.50000 % 0.00246 %
Formaldehyde, oligomeric reaction products with 1- 0.00000522 g 18.00000 % 0.00422 %
Misc. 0.00000203 g 7.00000 % 0.00164 %
1,4-Butane diglycidyl ether C10H18O4 0.00000305 g 10.50000 % 0.00246 %
Total: 0.00002900 g  
Lead Finish
Substances weight % of material % of package
Misc. 0.00000005 g 0.01000 % 0.00004 %
Tin Sn 0.00049795 g 99.99000 % 0.40215 %
Total: 0.00049800 g  
Magnet Adhesive / Adhesive Dots
Substances weight % of material % of package
Misc. 0.00000120 g 4.00000 % 0.00097 %
MQ Silicone Rubber Si 0.00002880 g 96.00000 % 0.02326 %
Total: 0.00003000 g  
Bump
Substances weight % of material % of package
Silver Ag 0.00000110 g 2.50000 % 0.00089 %
Tin Sn 0.00004290 g 97.50000 % 0.03465 %
Total: 0.00004400 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bump
Substances 0.00004400 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.018 ppm
Bromine Br   < 50 ppm < 0.018 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.018 ppm
Cadmium Cd   < 2 ppm < 0.001 ppm
Chlorine Cl   = 998 ppm = 0.355 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.018 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.018 ppm
Flourine Fl   < 50 ppm < 0.018 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.001 ppm
Iodine I   < 50 ppm < 0.018 ppm
Mercury Hg   < 2 ppm < 0.001 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.002 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.002 ppm
Die
Substances 0.00340000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 1.373 ppm
Bromine Br   < 50 ppm < 1.373 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 1.373 ppm
Cadmium Cd   < 2 ppm < 0.055 ppm
Chlorine Cl   < 50 ppm < 1.373 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 1.373 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 1.373 ppm
Flourine Fl   < 50 ppm < 1.373 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.055 ppm
Iodine I   < 50 ppm < 1.373 ppm
Lead Pb   < 2 ppm < 0.055 ppm
Mercury Hg   < 2 ppm < 0.055 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.137 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.137 ppm
Die Attach Adhesive
Substances 0.00002900 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 0.003 ppm < 0.000 ppm
Bromine Br   < 50 ppm < 0.012 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 0.003 ppm < 0.000 ppm
Cadmium Cd   < 2 ppm < 0.000 ppm
Chlorine Cl   = 226 ppm = 0.053 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 0.003 ppm < 0.000 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 0.003 ppm < 0.000 ppm
Hexabromocyclododecane (Flame Retardant) HBCDD   < 5 ppm < 0.001 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.000 ppm
Lead Pb   < 2 ppm < 0.000 ppm
Mercury Hg   < 2 ppm < 0.000 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.001 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.001 ppm
Encapsulation
Substances 0.07182000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 2 ppm < 1.160 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 29.002 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 29.002 ppm
Cadmium Cd   < 2 ppm < 1.160 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 29.002 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 29.002 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 1.160 ppm
Lead Pb   < 2 ppm < 1.160 ppm
Mercury Hg   < 2 ppm < 1.160 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 2.900 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 2.900 ppm
Lead Finish
Substances 0.00049800 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.201 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.201 ppm
Cadmium Cd   < 2 ppm < 0.008 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.201 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.201 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.008 ppm
Lead Pb   = 39 ppm = 0.157 ppm
Mercury Hg   < 2 ppm < 0.008 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.020 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.020 ppm
Leadframe
Substances 0.04800000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 19.383 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 19.383 ppm
Cadmium Cd   < 2 ppm < 0.775 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 19.383 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 19.383 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.775 ppm
Lead Pb   < 2 ppm < 0.775 ppm
Mercury Hg   < 2 ppm < 0.775 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.938 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.938 ppm
Magnet Adhesive / Adhesive Dots
Substances 0.00003000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.012 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.012 ppm
Cadmium Cd   < 2 ppm < 0.000 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.012 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.012 ppm
Hexabromocyclododecane (Flame Retardant) HBCDD   < 5 ppm < 0.001 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.000 ppm
Lead Pb   < 2 ppm < 0.000 ppm
Mercury Hg   < 2 ppm < 0.000 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.001 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.001 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

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