Materials Declaration Report: ATS627LSGTN-MN-T

Part Number: ATS627LSGTN-MN-T
Package Code: SG
Lead Count: 4
Plating: Sn
Package Weight: 1.0451 g
MSL Rating: *
*Through-hole devices not covered by J-STD-020.
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Magnet
Substances weight % of material % of package
Silicon Si 0.00004682 g 0.01000 % 0.00448 %
Zirconium Zr 0.01133044 g 2.42000 % 1.08415 %
Concentrator
Substances weight % of material % of package
Iron Fe 0.00279498 g 75.54000 % 0.26744 %
Total: 0.00370000 g  
Manganese Mn 0.00000925 g 0.25000 % 0.00089 %
Nickel Ni 0.00031450 g 8.50000 % 0.03009 %
Phosphorus (wht/yellow) P 0.00000074 g 0.02000 % 0.00007 %
Silicon Si 0.00000925 g 0.25000 % 0.00089 %
Sulfur S 0.00000056 g 0.01500 % 0.00005 %
Chromium Cr 0.00043475 g 11.75000 % 0.04160 %
Total: 0.00370000 g  
Titanium Ti 0.00004070 g 1.10000 % 0.00389 %
Carbon C 0.00000093 g 0.02500 % 0.00009 %
Total: 0.00370000 g  
Copper Cu 0.00007400 g 2.00000 % 0.00708 %
Niobium Nb 0.00001110 g 0.30000 % 0.00106 %
Total: 0.00370000 g  
Magnet
Substances weight % of material % of package
Samarium Sm 0.10197400 g 21.78000 % 9.75734 %
Iron Fe 0.07800212 g 16.66000 % 7.46360 %
Total: 0.46820000 g  
Cobalt Co 0.25203210 g 53.83000 % 24.11559 %
Aluminum Al 0.00004682 g 0.01000 % 0.00448 %
Silver Ag 0.00032774 g 0.07000 % 0.03136 %
Bonding Wire
Substances weight % of material % of package
Copper Cu 0.00000001 g 0.00290 % 0.00000 %
Total: 0.00020000 g  
Misc. 0.00000000 g 0.00097 % 0.00000 %
Gold Au 0.00019999 g 99.99323 % 0.01914 %
Silver Ag 0.00000001 g 0.00290 % 0.00000 %
Lead Finish
Substances weight % of material % of package
Tin Sn 0.00999900 g 99.99000 % 0.95675 %
Misc. 0.00000100 g 0.01000 % 0.00010 %
Die Attach Adhesive
Substances weight % of material % of package
Polyimide Pi 0.00036000 g 30.00000 % 0.03445 %
Silver Ag 0.00084000 g 70.00000 % 0.08038 %
Total: 0.00120000 g  
Die
Substances weight % of material % of package
Silicon Si 0.00796800 g 99.60000 % 0.76242 %
Aluminum Al 0.00003200 g 0.40000 % 0.00306 %
Encapsulation
Substances weight % of material % of package
Silicon Dioxide O2Si 0.20350000 g 55.00000 % 19.47182 %
Epoxy Resin / Basic Durometer EP 0.10249000 g 27.70000 % 9.80672 %
Acrylic Resin 0.02775000 g 7.50000 % 2.65525 %
Solid Epoxy Resin EP 0.00111000 g 0.30000 % 0.10621 %
Misc. 0.01480000 g 4.00000 % 1.41613 %
Fused silica SiO2 0.02035000 g 5.50000 % 1.94718 %
Leadframe
Substances weight % of material % of package
Copper Cu 0.17901690 g 99.87500 % 17.12917 %
Zirconium Zr 0.00015684 g 0.08750 % 0.01501 %
Misc. 0.00006722 g 0.03750 % 0.00643 %
Concentrator
Substances weight % of material % of package
Molybdenum Mo 0.00000925 g 0.25000 % 0.00089 %
Total: 0.00370000 g  
Magnet Adhesive / Adhesive Dots
Substances weight % of material % of package
Silver Ag 0.00253500 g 84.50000 % 0.24256 %
Polyimide Pi 0.00046500 g 15.50000 % 0.04449 %
Total: 0.00300000 g  
Wafer/Die Coating
Substances weight % of material % of package
Misc. 0.00000120 g 0.10000 % 0.00011 %
Polyimide Pi 0.00119880 g 99.90000 % 0.11471 %
Total: 0.00120000 g  
Internal Leadframe Finish
Substances weight % of material % of package
Silver Ag 0.00035864 g 99.90000 % 0.03432 %
Sulfur S 0.00000018 g 0.05000 % 0.00002 %
Carbon C 0.00000018 g 0.05000 % 0.00002 %
Total: 0.00035900 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00020000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.010 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.010 ppm
Cadmium Cd   < 2 ppm < 0.000 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.010 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.010 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.000 ppm
Lead Pb   < 2 ppm < 0.000 ppm
Mercury Hg   < 2 ppm < 0.000 ppm
Polybrominated Biphenyls PBB   < 10 ppm < 0.002 ppm
Polybrominated Diphenyl Ethers PBDE   < 10 ppm < 0.002 ppm
Concentrator
Substances 0.00370000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.177 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.177 ppm
Cadmium Cd   < 2 ppm < 0.007 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.177 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.177 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.007 ppm
Lead Pb   < 2 ppm < 0.007 ppm
Mercury Hg   < 2 ppm < 0.007 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.018 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.018 ppm
Die
Substances 0.00800000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.383 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.383 ppm
Cadmium Cd   < 2 ppm < 0.015 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.383 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.383 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.015 ppm
Lead Pb   < 2 ppm < 0.015 ppm
Mercury Hg   < 2 ppm < 0.015 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.038 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.038 ppm
Die Attach Adhesive
Substances 0.00120000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.057 ppm
Bromine Br   < 50 ppm < 0.057 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.057 ppm
Cadmium Cd   < 2 ppm < 0.002 ppm
Chlorine Cl   < 50 ppm < 0.057 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.057 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.057 ppm
Flourine Fl   < 50 ppm < 0.057 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.002 ppm
Iodine I   < 50 ppm < 0.057 ppm
Lead Pb   < 2 ppm < 0.002 ppm
Mercury Hg   < 2 ppm < 0.002 ppm
Polybrominated Biphenyls PBB   < 50 ppm < 0.057 ppm
Polybrominated Diphenyl Ethers PBDE   < 50 ppm < 0.057 ppm
Encapsulation
Substances 0.37000000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   = 4080 ppm = 1444.455 ppm
Beryllium Be   < 2 ppm < 0.708 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 17.702 ppm
Bromine Br   = 7660 ppm = 2711.894 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 17.702 ppm
Cadmium Cd   < 2 ppm < 0.708 ppm
Chlorine Cl   = 97.4 ppm = 34.483 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 17.702 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 17.702 ppm
Hexabromocyclododecane (Flame Retardant) HBCDD   < 5 ppm < 1.770 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.708 ppm
Lead Pb   < 2 ppm < 0.708 ppm
Mercury Hg   < 2 ppm < 0.708 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.770 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.770 ppm
Internal Leadframe Finish
Substances 0.00035900 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 30 ppm < 0.010 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 30 ppm < 0.010 ppm
Cadmium Cd   < 2 ppm < 0.001 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 30 ppm < 0.010 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 30 ppm < 0.010 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.001 ppm
Lead Pb   < 2 ppm < 0.001 ppm
Mercury Hg   < 2 ppm < 0.001 ppm
Polybrominated Biphenyls PBB   < 2 ppm < 0.001 ppm
Polybrominated Diphenyl Ethers PBDE   < 2 ppm < 0.001 ppm
Lead Finish
Substances 0.01000000 g ppm w/avg ppm
Cadmium Cd   < 2 ppm < 0.019 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.019 ppm
Lead Pb   < 2 ppm < 0.019 ppm
Mercury Hg   < 2 ppm < 0.019 ppm
Polybrominated Biphenyls PBB   < 0.1 ppm < 0.001 ppm
Polybrominated Diphenyl Ethers PBDE   < 0.1 ppm < 0.001 ppm
Leadframe
Substances 0.17924100 g ppm w/avg ppm
Cadmium Cd   < 2 ppm < 0.343 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.343 ppm
Lead Pb   < 2 ppm < 0.343 ppm
Mercury Hg   < 2 ppm < 0.343 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.858 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.858 ppm
Magnet
Substances 0.46820000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 22.400 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 22.400 ppm
Cadmium Cd   < 2 ppm < 0.896 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 22.400 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 22.400 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.896 ppm
Lead Pb   < 2 ppm < 0.896 ppm
Mercury Hg   < 2 ppm < 0.896 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 2.240 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 2.240 ppm
Magnet Adhesive / Adhesive Dots
Substances 0.00300000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   = 51.5 ppm = 0.148 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.144 ppm
Cadmium Cd   < 2 ppm < 0.006 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.144 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.144 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.006 ppm
Lead Pb   < 2 ppm < 0.006 ppm
Mercury Hg   < 2 ppm < 0.006 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.014 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.014 ppm
Wafer/Die Coating
Substances 0.00120000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.057 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.057 ppm
Cadmium Cd   < 2 ppm < 0.002 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.057 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.057 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.002 ppm
Lead Pb   < 2 ppm < 0.002 ppm
Mercury Hg   < 2 ppm < 0.002 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.006 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.006 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

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