Materials Declaration Report: ATS635LSETN-T

Part Number: ATS635LSETN-T
Package Code: SE
Lead Count: 4
Plating: Sn
Package Weight: 2.2428 g
MSL Rating: TBD
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Magnet
Substances weight % of material % of package
Silicon Si 0.00012970 g 0.01000 % 0.00578 %
Zirconium Zr 0.03138740 g 2.42000 % 1.39947 %
Concentrator
Substances weight % of material % of package
Iron Fe 0.00649644 g 75.54000 % 0.28966 %
Total: 0.00860000 g  
Manganese Mn 0.00002150 g 0.25000 % 0.00096 %
Nickel Ni 0.00073100 g 8.50000 % 0.03259 %
Phosphorus (wht/yellow) P 0.00000172 g 0.02000 % 0.00008 %
Silicon Si 0.00002150 g 0.25000 % 0.00096 %
Sulfur S 0.00000129 g 0.01500 % 0.00006 %
Chromium Cr 0.00101050 g 11.75000 % 0.04506 %
Total: 0.00860000 g  
Titanium Ti 0.00009460 g 1.10000 % 0.00422 %
Carbon C 0.00000215 g 0.02500 % 0.00010 %
Total: 0.00860000 g  
Copper Cu 0.00017200 g 2.00000 % 0.00767 %
Niobium Nb 0.00002580 g 0.30000 % 0.00115 %
Total: 0.00860000 g  
Molybdenum Mo 0.00002150 g 0.25000 % 0.00096 %
Magnet Adhesive / Adhesive Dots
Substances weight % of material % of package
Silver Ag 0.00253500 g 84.50000 % 0.11303 %
Total: 0.00300000 g  
Polyimide Pi 0.00046500 g 15.50000 % 0.02073 %
Magnet
Substances weight % of material % of package
Samarium Sm 0.28248660 g 21.78000 % 12.59526 %
Iron Fe 0.21608020 g 16.66000 % 9.63440 %
Cobalt Co 0.69817510 g 53.83000 % 31.12962 %
Total: 1.29700000 g  
Aluminum Al 0.00012970 g 0.01000 % 0.00578 %
Silver Ag 0.00090790 g 0.07000 % 0.04048 %
Bonding Wire
Substances weight % of material % of package
Copper Cu 0.00000001 g 0.00290 % 0.00000 %
Misc. 0.00000000 g 0.00097 % 0.00000 %
Gold Au 0.00019999 g 99.99323 % 0.00892 %
Silver Ag 0.00000001 g 0.00290 % 0.00000 %
Lead Finish
Substances weight % of material % of package
Tin Sn 0.01799820 g 99.99000 % 0.80249 %
Total: 0.01800000 g  
Misc. 0.00000180 g 0.01000 % 0.00008 %
Die Attach Adhesive
Substances weight % of material % of package
Polyimide Pi 0.00036000 g 30.00000 % 0.01605 %
Silver Ag 0.00084000 g 70.00000 % 0.03745 %
Die
Substances weight % of material % of package
Silicon Si 0.00498000 g 99.60000 % 0.22204 %
Aluminum Al 0.00002000 g 0.40000 % 0.00089 %
Encapsulation
Substances weight % of material % of package
Silicon Dioxide O2Si 0.34980000 g 55.00000 % 15.59658 %
Epoxy Resin / Basic Durometer EP 0.17617200 g 27.70000 % 7.85500 %
Acrylic Resin 0.04770000 g 7.50000 % 2.12681 %
Solid Epoxy Resin EP 0.00190800 g 0.30000 % 0.08507 %
Misc. 0.02544000 g 4.00000 % 1.13430 %
Fused silica SiO2 0.03498000 g 5.50000 % 1.55966 %
Leadframe
Substances weight % of material % of package
Copper Cu 0.27345770 g 99.87500 % 12.19269 %
Total: 0.27380000 g  
Zirconium Zr 0.00023958 g 0.08750 % 0.01068 %
Misc. 0.00010268 g 0.03750 % 0.00458 %
Total: 0.27380000 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00020000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.004 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.004 ppm
Cadmium Cd   < 2 ppm < 0.000 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.004 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.004 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.000 ppm
Lead Pb   < 2 ppm < 0.000 ppm
Mercury Hg   < 2 ppm < 0.000 ppm
Polybrominated Biphenyls PBB   < 10 ppm < 0.001 ppm
Polybrominated Diphenyl Ethers PBDE   < 10 ppm < 0.001 ppm
Concentrator
Substances 0.00860000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.192 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.192 ppm
Cadmium Cd   < 2 ppm < 0.008 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.192 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.192 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.008 ppm
Lead Pb   < 2 ppm < 0.008 ppm
Mercury Hg   < 2 ppm < 0.008 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.019 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.019 ppm
Die
Substances 0.00500000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.111 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.111 ppm
Cadmium Cd   < 2 ppm < 0.004 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.111 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.111 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.004 ppm
Lead Pb   < 2 ppm < 0.004 ppm
Mercury Hg   < 2 ppm < 0.004 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.011 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.011 ppm
Die Attach Adhesive
Substances 0.00120000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.027 ppm
Bromine Br   < 50 ppm < 0.027 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.027 ppm
Cadmium Cd   < 2 ppm < 0.001 ppm
Chlorine Cl   < 50 ppm < 0.027 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.027 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.027 ppm
Flourine Fl   < 50 ppm < 0.027 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.001 ppm
Iodine I   < 50 ppm < 0.027 ppm
Lead Pb   < 2 ppm < 0.001 ppm
Mercury Hg   < 2 ppm < 0.001 ppm
Polybrominated Biphenyls PBB   < 50 ppm < 0.027 ppm
Polybrominated Diphenyl Ethers PBDE   < 50 ppm < 0.027 ppm
Encapsulation
Substances 0.63600000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   = 4080 ppm = 1156.982 ppm
Beryllium Be   < 2 ppm < 0.567 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 14.179 ppm
Bromine Br   = 7660 ppm = 2172.178 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 14.179 ppm
Cadmium Cd   < 2 ppm < 0.567 ppm
Chlorine Cl   = 97.4 ppm = 27.620 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 14.179 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 14.179 ppm
Hexabromocyclododecane (Flame Retardant) HBCDD   < 5 ppm < 1.418 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.567 ppm
Lead Pb   < 2 ppm < 0.567 ppm
Mercury Hg   < 2 ppm < 0.567 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.418 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.418 ppm
Lead Finish
Substances 0.01800000 g ppm w/avg ppm
Cadmium Cd   < 2 ppm < 0.016 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.016 ppm
Lead Pb   < 2 ppm < 0.016 ppm
Mercury Hg   < 2 ppm < 0.016 ppm
Polybrominated Biphenyls PBB   < 0.1 ppm < 0.001 ppm
Polybrominated Diphenyl Ethers PBDE   < 0.1 ppm < 0.001 ppm
Leadframe
Substances 0.27380000 g ppm w/avg ppm
Cadmium Cd   < 2 ppm < 0.244 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.244 ppm
Lead Pb   < 2 ppm < 0.244 ppm
Mercury Hg   < 2 ppm < 0.244 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.610 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.610 ppm
Magnet
Substances 1.29700000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 28.915 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 28.915 ppm
Cadmium Cd   < 2 ppm < 1.157 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 28.915 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 28.915 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 1.157 ppm
Lead Pb   < 2 ppm < 1.157 ppm
Mercury Hg   < 2 ppm < 1.157 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 2.891 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 2.891 ppm
Magnet Adhesive / Adhesive Dots
Substances 0.00300000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   = 51.5 ppm = 0.069 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.067 ppm
Cadmium Cd   < 2 ppm < 0.003 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.067 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.067 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.003 ppm
Lead Pb   < 2 ppm < 0.003 ppm
Mercury Hg   < 2 ppm < 0.003 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.007 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.007 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

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