Materials Declaration Report: ATS668LSMTN-T

Part Number: ATS668LSMTN-T
Package Code: SM
Lead Count: 3
Plating: Sn
Package Weight: 0.796042 g
MSL Rating: TBD
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Leadframe
Substances weight % of material % of package
Misc. 0.00005426 g 0.03750 % 0.00682 %
Zirconium Zr 0.00012661 g 0.08750 % 0.01591 %
Copper Cu 0.14451910 g 99.87500 % 18.15471 %
Total: 0.14470000 g  
Encapsulation
Substances weight % of material % of package
Fused silica SiO2 0.21679000 g 81.50000 % 27.23349 %
Carbon C 0.00172900 g 0.65000 % 0.21720 %
Epoxy Resin / Basic Durometer EP 0.01848700 g 6.95000 % 2.32237 %
Phenol Resin 0.01050700 g 3.95000 % 1.31991 %
Silicon Dioxide O2Si 0.01848700 g 6.95000 % 2.32237 %
Total: 0.26600000 g  
Die
Substances weight % of material % of package
Aluminum Al 0.00002046 g 0.40000 % 0.00257 %
Silicon Si 0.00509354 g 99.60000 % 0.63986 %
Total: 0.00511400 g  
Die Attach Adhesive
Substances weight % of material % of package
Misc. 0.00000600 g 2.00000 % 0.00075 %
Zinc Oxide ZnO 0.00000750 g 2.50000 % 0.00094 %
Epoxy Resin / Basic Durometer EP 0.00018150 g 60.50000 % 0.02280 %
Calcium Carbonate CaCO3 0.00010500 g 35.00000 % 0.01319 %
Total: 0.00030000 g  
Lead Finish
Substances weight % of material % of package
Misc. 0.00000086 g 0.01000 % 0.00011 %
Tin Sn 0.00859914 g 99.99000 % 1.08024 %
Total: 0.00860000 g  
Bonding Wire
Substances weight % of material % of package
Silver Ag 0.00000000 g 0.00290 % 0.00000 %
Gold Au 0.00005000 g 99.99323 % 0.00628 %
Misc. 0.00000000 g 0.00097 % 0.00000 %
Copper Cu 0.00000000 g 0.00290 % 0.00000 %
Total: 0.00005000 g  
Magnet
Substances weight % of material % of package
Silver Ag 0.00023352 g 0.07000 % 0.02934 %
Aluminum Al 0.00003336 g 0.01000 % 0.00419 %
Cobalt Co 0.17957690 g 53.83000 % 22.55872 %
Iron Fe 0.05557776 g 16.66000 % 6.98176 %
Samarium Sm 0.07265808 g 21.78000 % 9.12742 %
Silicon Si 0.00003336 g 0.01000 % 0.00419 %
Zirconium Zr 0.00807312 g 2.42000 % 1.01416 %
Total: 0.33360000 g  
Concentrator
Substances weight % of material % of package
Iron Fe 0.02115120 g 75.54000 % 2.65705 %
Manganese Mn 0.00007000 g 0.25000 % 0.00879 %
Nickel Ni 0.00238000 g 8.50000 % 0.29898 %
Phosphorus (wht/yellow) P 0.00000560 g 0.02000 % 0.00070 %
Silicon Si 0.00007000 g 0.25000 % 0.00879 %
Sulfur S 0.00000420 g 0.01500 % 0.00053 %
Chromium Cr 0.00329000 g 11.75000 % 0.41329 %
Titanium Ti 0.00030800 g 1.10000 % 0.03869 %
Carbon C 0.00000700 g 0.02500 % 0.00088 %
Copper Cu 0.00056000 g 2.00000 % 0.07035 %
Niobium Nb 0.00008400 g 0.30000 % 0.01055 %
Molybdenum Mo 0.00007000 g 0.25000 % 0.00879 %
Total: 0.02800000 g  
Magnet Adhesive / Adhesive Dots
Substances weight % of material % of package
Bismaleimide resin 0.00028700 g 41.00000 % 0.03605 %
Additive 0.00002800 g 4.00000 % 0.00352 %
Polytetrafloroethylene 0.00029400 g 42.00000 % 0.03693 %
Polybutadiene 0.00009100 g 13.00000 % 0.01143 %
Total: 0.00070000 g  
Passive Attachment
Substances weight % of material % of package
Antimony/Antimony compounds Sb2O3 0.00003409 g 4.87000 % 0.00428 %
Misc. 0.00003829 g 5.47000 % 0.00481 %
Tin Sn 0.00062762 g 89.66000 % 0.07884 %
Total: 0.00070000 g  
Concentrator Attach Adhesive
Substances weight % of material % of package
Additive 0.00004800 g 6.00000 % 0.00603 %
Silicon Dioxide O2Si 0.00008800 g 11.00000 % 0.01105 %
Isobornyl acrylate 0.00012000 g 15.00000 % 0.01507 %
Silicon dioxide, surface treated 0.00025200 g 31.50000 % 0.03166 %
Phenyl Methacrylate 0.00008800 g 11.00000 % 0.01105 %
2,5-Furandione, polymer with 1,3-butadiene 0.00004800 g 6.00000 % 0.00603 %
(2,4,6-trioxo-1,3,5-triazine-1,3,5(2H,4H,6H)-triyl 0.00002400 g 3.00000 % 0.00301 %
Dihexyl fumarate 0.00013200 g 16.50000 % 0.01658 %
Total: 0.00080000 g  
Internal Leadframe Finish
Substances weight % of material % of package
Silver Ag 0.00335664 g 99.90000 % 0.42167 %
Sulfur S 0.00000168 g 0.05000 % 0.00021 %
Carbon C 0.00000168 g 0.05000 % 0.00021 %
Total: 0.00336000 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00005000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.003 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.003 ppm
Cadmium Cd   < 2 ppm < 0.000 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.003 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.003 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.000 ppm
Lead Pb   < 2 ppm < 0.000 ppm
Mercury Hg   < 2 ppm < 0.000 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.000 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.000 ppm
Concentrator
Substances 0.02800000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 1.759 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 1.759 ppm
Cadmium Cd   < 2 ppm < 0.070 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 1.759 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 1.759 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.070 ppm
Lead Pb   < 2 ppm < 0.070 ppm
Mercury Hg   < 2 ppm < 0.070 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.176 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.176 ppm
Concentrator Attach Adhesive
Substances 0.00080000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 2 ppm < 0.002 ppm
Beryllium Be   < 2 ppm < 0.002 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.050 ppm
Bromine Br   < 50 ppm < 0.050 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.050 ppm
Cadmium Cd   < 2 ppm < 0.002 ppm
Chlorine Cl   = 127 ppm = 0.128 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.050 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.050 ppm
Hexabromocyclododecane (Flame Retardant) HBCDD   < 5 ppm < 0.005 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.002 ppm
Lead Pb   < 2 ppm < 0.002 ppm
Mercury Hg   < 2 ppm < 0.002 ppm
PFOA PFOA   < 10 ppm < 0.010 ppm
PFOS PFOS   < 10 ppm < 0.010 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.005 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.005 ppm
Die
Substances 0.00511400 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.321 ppm
Bromine Br   < 50 ppm < 0.321 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.321 ppm
Cadmium Cd   < 2 ppm < 0.013 ppm
Chlorine Cl   < 50 ppm < 0.321 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.321 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.321 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.013 ppm
Iodine I   < 50 ppm < 0.321 ppm
Lead Pb   < 2 ppm < 0.013 ppm
Mercury Hg   < 2 ppm < 0.013 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.032 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.032 ppm
Die Attach Adhesive
Substances 0.00030000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.019 ppm
Bromine Br   < 50 ppm < 0.019 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.019 ppm
Cadmium Cd   < 2 ppm < 0.001 ppm
Chlorine Cl   = 290 ppm = 0.109 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.019 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.019 ppm
Flourine Fl   < 50 ppm < 0.019 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.001 ppm
Iodine I   < 50 ppm < 0.019 ppm
Lead Pb   < 2 ppm < 0.001 ppm
Mercury Hg   < 2 ppm < 0.001 ppm
Polybrominated Biphenyls PBB   < 50 ppm < 0.019 ppm
Polybrominated Diphenyl Ethers PBDE   < 50 ppm < 0.019 ppm
Encapsulation
Substances 0.26600000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 16.708 ppm
Bromine Br   < 50 ppm < 16.708 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 16.708 ppm
Cadmium Cd   < 2 ppm < 0.668 ppm
Chlorine Cl   < 50 ppm < 16.708 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 16.708 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 16.708 ppm
Flourine Fl   < 50 ppm < 16.708 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.668 ppm
Iodine I   < 50 ppm < 16.708 ppm
Lead Pb   < 2 ppm < 0.668 ppm
Mercury Hg   < 2 ppm < 0.668 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.671 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.671 ppm
Internal Leadframe Finish
Substances 0.00336000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.211 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.211 ppm
Cadmium Cd   < 2 ppm < 0.008 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.211 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.211 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.008 ppm
Lead Pb   = 5 ppm = 0.021 ppm
Mercury Hg   < 2 ppm < 0.008 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.021 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.021 ppm
Lead Finish
Substances 0.00860000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 13 ppm < 0.140 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 13 ppm < 0.140 ppm
Cadmium Cd   < 2 ppm < 0.022 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 13 ppm < 0.140 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 13 ppm < 0.140 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.022 ppm
Lead Pb   = 52 ppm = 0.562 ppm
Mercury Hg   < 2 ppm < 0.022 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.054 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.054 ppm
Leadframe
Substances 0.14470000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 10 ppm < 1.818 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 9.089 ppm
Bromine Br   < 50 ppm < 9.089 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 9.089 ppm
Cadmium Cd   < 2 ppm < 0.364 ppm
Chlorine Cl   < 50 ppm < 9.089 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 9.089 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 9.089 ppm
Flourine Fl   < 50 ppm < 9.089 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.364 ppm
Iodine I   < 50 ppm < 9.089 ppm
Lead Pb   = 4 ppm = 0.727 ppm
Mercury Hg   < 2 ppm < 0.364 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.909 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.909 ppm
Magnet
Substances 0.33360000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 20.954 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 20.954 ppm
Cadmium Cd   < 2 ppm < 0.838 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 20.954 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 20.954 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.838 ppm
Lead Pb   < 2 ppm < 0.838 ppm
Mercury Hg   < 2 ppm < 0.838 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 2.095 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 2.095 ppm
Magnet Adhesive / Adhesive Dots
Substances 0.00070000 g ppm w/avg ppm
Beryllium Be   < 2 ppm < 0.002 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.044 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.044 ppm
Cadmium Cd   < 2 ppm < 0.002 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.044 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.044 ppm
Hexabromocyclododecane (Flame Retardant) HBCDD   < 5 ppm < 0.004 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.002 ppm
Lead Pb   < 2 ppm < 0.002 ppm
Mercury Hg   < 2 ppm < 0.002 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.004 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.004 ppm
Passive Attachment
Substances 0.00070000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   = 43200 ppm = 37.988 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 200 ppm < 0.176 ppm
Bromine Br   < 10 ppm < 0.009 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 100 ppm < 0.088 ppm
Cadmium Cd   < 10 ppm < 0.009 ppm
Chlorine Cl   < 10 ppm < 0.009 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 100 ppm < 0.088 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 100 ppm < 0.088 ppm
Flourine Fl   < 10 ppm < 0.009 ppm
Hexavalent Chromium Cr+6   < 10 ppm < 0.009 ppm
Iodine I   < 10 ppm < 0.009 ppm
Lead Pb   = 93 ppm = 0.082 ppm
Mercury Hg   < 5 ppm < 0.004 ppm
Polybrominated Biphenyls PBB   < 300 ppm < 0.264 ppm
Polybrominated Diphenyl Ethers PBDE   < 300 ppm < 0.264 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

.

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