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Worcester, MA, January 25, 2007 Allegro® MicroSystems, Inc. announces two new transistors targeted at the home and professional audio amplifiers markets. These two new devices utilize a thinner-die technology technique to achieve improved power-up by decreasing thermal resistance, and by providing a higher voltage avalanche breakdown rating.
The high power-handling capacity of the TO-3P package contributes to a smaller space for circuit design. This series is highly suitable to not only multi-channel applications for AV amplifiers and receivers, but also parallel connection applications for PA amplifiers.
About Allegro
Allegro MicroSystems, Inc. is a global leader in the development, manufacture and marketing of high-performance power integrated circuits and integrated Hall-effect magnetic sensors. Allegro's innovative, system-level solutions serve high-growth applications within the automotive, computer/office automation, industrial, consumer and communications markets. With more than 2,500 employees, Allegro is headquartered in Worcester, MA. Further information about Allegro can be found at www.allegromicro.com.
Editorial Contact:
Stephanie Fennelly
Director – Marketing Communications
Tel: (508) 854-5363
sfennelly@allegromicro.com