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Worcester, MA, January 25, 2007 Allegro® MicroSystems, Inc. announces two new transistors targeted at the home and professional audio amplifiers markets. These two new devices utilize a thinner-die technology technique to achieve improved power-up by decreasing thermal resistance, and by providing a higher voltage avalanche breakdown rating.
The high power-handling capacity of the TO-3P package contributes to a smaller space for circuit design. This series is highly suitable to not only multi-channel applications for AV amplifiers and receivers, but also parallel connection applications for PA amplifiers.
About Allegro
Allegro MicroSystems, Inc. is a leader in developing, manufacturing and marketing high-performance power and Hall-effect sensor integrated circuits. Allegro's innovative solutions serve high-growth applications within the automotive, communications, computer/office automation, consumer and industrial markets. Allegro is headquartered in Worcester, Massachusetts (USA) with design and applications centers located in North and South America, Asia, and Europe. Further information about Allegro can be found at www.allegromicro.com.
Editorial Contact:
Stephanie Fennelly
Director - Marketing Communications
Tel: (508) 854-5363
sfennelly@allegromicro.com