Power IC Package Portfolio

Integrated Circuits

 
Allegro MicroSystems, LLC is a leader in developing, manufacturing and marketing high-performance semiconductors. Allegro's innovative solutions serve high-growth applications within the automotive market, with additional focus on office automation, industrial, and consumer/communications solutions.

Allegro’s power IC packages offer industry-leading thermal performance with limited board space.

  • TSSOP – Industry-standard TSSOP with optional exposed pad for enhanced thermal performance
  • QFP – Universal quad flat pack with exposed pad for enhanced thermal performance
  • QFN/TDFN – Quad and dual, low-profile, surface-mount packages with exposed pad for enhanced thermal performance
  • MSOP – Industry-standard miniature small outline package with optional exposed pad for enhanced thermal performance
  • SOIC – Small outline integrated circuit with optional exposed pad for enhanced thermal performance
  • CSP – Wafer level chip scale

Additional industry-standard packaging options are available to meet individual design requirements. 

The package options shown below are a sampling of Allegro’s most recent, high technology packages. 

Click here for a PDF version.

Power IC Packages

Allegro Package Selection Guide

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