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Semiconductor Packaging Publications
Package Designators
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Package Dimensions
Package Mechanical Characteristics
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Package Thermal Characteristics
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Back-Biased Packaging Advances
Guidelines for Designing Subassemblies Using Hall-Effect Devices
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Improving Batwing Power Dissipation
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Procedure for Measuring Pad-to-Ambient Thermal Resistance (R
θPA
) for Exposed Pad Packages
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Soldering Methods for Allegro's Products — SMD and Through-Hole
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Chemical Exposure of Devices
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Thermal Design for Plastic Integrated Circuits
(PDF)
