Allegro MicroSystems, Inc.
Materials Declaration Report

Part Number:

A3189ELT

Package Code:

Lead Count:

Plating:

Sn/Pb

Package Weight:

0.0527 g

*Through-hole devices not covered by J-STD-020.

Composition Details

Bonding Wire
Substances			weight	% of material	% of package
	Gold	Au	0.00005000 g	99.99002%	0.09487%
	Misc.		0.00000000 g	0.00995%	0.00001%
	Silver	Ag	0.00000000 g	0.00003%	0.00000%
Total:			0.00005000 g
Die
Substances			weight	% of material	% of package
	Aluminum	Al	0.00003000 g	1.00000%	0.05693%
	Silicon	Si	0.00297000 g	99.00000%	5.63567%
Total:			0.00300000 g
Die Attach Adhesive
Substances			weight	% of material	% of package
	Silver	Ag	0.00084000 g	70.00000%	1.59393%
	Polyimide	Pl	0.00036000 g	30.00000%	0.68311%
Total:			0.00120000 g
Encapsulation
Substances			weight	% of material	% of package
	2,2',6,6'-Tetrabromo-4,4'-isopropylidenediphenol	TBBPA	0.00046800 g	2.00000%	0.88805%
	2,6-Dibromo-4-(1-(3-bromo-4-hydroxyphenyl)-1-methy		0.00002340 g	0.10000%	0.04440%
	Antimony Trioxide	Sb2O3	0.00023353 g	0.99800%	0.44313%
	Carbon black	C	0.00007020 g	0.30000%	0.13321%
	Crystalline silica	SiO2	0.01643148 g	70.22000%	31.17928%
	Epoxy cresol novolac resin		0.00441839 g	18.88200%	8.38404%
	Phenolic resin		0.00175500 g	7.50000%	3.33017%
Total:			0.02340000 g
Lead Finish
Substances			weight	% of material	% of package
	Lead	Pb	0.00013000 g	10.00000%	0.24668%
	Tin	Sn	0.00117000 g	90.00000%	2.22011%
Total:			0.00130000 g
Lead Frame
Substances			weight	% of material	% of package
	Copper	Cu	0.02370488 g	99.81000%	44.98079%
	Misc.		0.00000950 g	0.04000%	0.01803%
	Zirconium	Zr	0.00003563 g	0.15000%	0.06760%
Total:			0.02375000 g
For information on "Green" molding compounds, please contact your local sales representative.

RoHS and other substances of concern

Bonding Wire
Substances			0.00005000 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.002 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.002 ppm
	Lead	Pb		= 3.00 ppm	= 0.003 ppm
	Mercury	Hg		< 2.00 ppm	< 0.002 ppm
	Polybrominated Biphenyls	PBB		< 10.00 ppm	< 0.009 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 10.00 ppm	< 0.009 ppm
Die
Substances			0.00300000 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.114 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.114 ppm
	Lead	Pb		< 2.00 ppm	< 0.114 ppm
	Mercury	Hg		< 2.00 ppm	< 0.114 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.285 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.285 ppm
Die Attach Adhesive
Substances			0.00120000 g	ppm	w/avg ppm
	Antimony Trioxide	Sb2O3		< 2.00 ppm	< 0.046 ppm
	Bromine	Br		< 50.00 ppm	< 1.139 ppm
	Cadmium	Cd		< 2.00 ppm	< 0.046 ppm
	Chlorine	Cl		< 50.00 ppm	< 1.139 ppm
	Flourine	Fl		< 50.00 ppm	< 1.139 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.046 ppm
	Iodine	I		< 50.00 ppm	< 1.139 ppm
	Lead	Pb		< 2.00 ppm	< 0.046 ppm
	Mercury	Hg		< 2.00 ppm	< 0.046 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.114 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.114 ppm
Encapsulation
Substances			0.02340000 g	ppm	w/avg ppm
	Antimony Trioxide	Sb2O3		= 9,980.00 ppm	= 4,431.347 ppm
	Bromine	Br		= 13,800.00 ppm	= 6,127.514 ppm
	Cadmium	Cd		< 2.00 ppm	< 0.888 ppm
	Chlorine	Cl		= 450.00 ppm	= 199.810 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.888 ppm
	Lead	Pb		< 2.00 ppm	< 0.888 ppm
	Mercury	Hg		< 2.00 ppm	< 0.888 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 2.220 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 2.220 ppm
Lead Finish
Substances			0.00130000 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.049 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.049 ppm
	Lead	Pb		= 6,225.00 ppm	= 153.558 ppm
	Mercury	Hg		< 2.00 ppm	< 0.049 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.123 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.123 ppm
Lead Frame
Substances			0.02375000 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.901 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.901 ppm
	Lead	Pb		< 2.00 ppm	< 0.901 ppm
	Mercury	Hg		< 2.00 ppm	< 0.901 ppm
	Nickel	Ni		= 0.00 ppm	= 0.000 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 2.253 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 2.253 ppm
The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed. RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd. Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel. Weighted average = for part as a whole. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.

Dear Customer:

Please note that, as a supplier of components, we are not required to assess regulatory requirements that may apply to the finished product such as the European RoHS Directive (2003/95/EC), hereinafter referred to as “RoHS”. Please note further that A3189ELT may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds, if that is your wish.

Allegro MicroSystems, Inc. is a cooperative environmental supplier who fully supports the global environmental initiatives. We value our relationship and we are committed to furthering our cooperation.

Geoffrey H. DesRosiers
Quality Systems Specialist

Allegro MicroSystems, Inc. Materials Declaration Report

Composition Details

Bonding Wire

Die

Die Attach Adhesive

Encapsulation

Lead Finish

Lead Frame