Allegro MicroSystems, Inc.
Materials Declaration Report

Part Number:

A3958SB-T

Package Code:

Lead Count:

Plating:

Package Weight:

1.7789 g

*Through-hole devices not covered by J-STD-020.

Composition Details

Bonding Wire
Substances			weight	% of material	% of package
	Gold	Au	0.00177872 g	99.99002%	0.09999%
	Misc.		0.00000018 g	0.00995%	0.00001%
	Silver	Ag	0.00000000 g	0.00003%	0.00000%
Total:			0.00177890 g
Die
Substances			weight	% of material	% of package
	Aluminum	Al	0.00007000 g	1.00000%	0.00394%
	Silicon	Si	0.00693000 g	99.00000%	0.38957%
Total:			0.00700000 g
Die Attach Adhesive
Substances			weight	% of material	% of package
	Silver	Ag	0.00098400 g	82.00000%	0.05532%
	Epoxy resin	EP	0.00018000 g	15.00000%	0.01012%
	Misc.		0.00003600 g	3.00000%	0.00202%
Total:			0.00120000 g
Encapsulation
Substances			weight	% of material	% of package
	Carbon black	C	0.00351600 g	0.30000%	0.19765%
	Epoxy cresol novolac resin		0.02344000 g	2.00000%	1.31767%
	Epoxy resin	EP	0.05860000 g	5.00000%	3.29417%
	Fused silica	SiO2	1.02784400 g	87.70000%	57.77975%
	Phenolic Resin		0.05860000 g	5.00000%	3.29417%
Total:			1.17200000 g
Lead Finish
Substances			weight	% of material	% of package
	Misc.		0.00000247 g	0.01000%	0.00014%
	Tin	Sn	0.02469753 g	99.99000%	1.38836%
Total:			0.02470000 g
Lead Frame
Substances			weight	% of material	% of package
	Copper	Cu	0.55729870 g	97.39218%	31.32827%
	Iron	Fe	0.01344720 g	2.35000%	0.75593%
	Lead	Pb	0.00000469 g	0.00082%	0.00026%
	Phosphorus	P	0.00046922 g	0.08200%	0.02638%
	Zinc (metal)	Zn	0.00100139 g	0.17500%	0.05629%
Total:			0.57222110 g
For information on "Green" molding compounds, please contact your local sales representative.

RoHS and other substances of concern

Bonding Wire
Substances			0.00177890 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.002 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.002 ppm
	Lead	Pb		< 2.00 ppm	< 0.002 ppm
	Mercury	Hg		< 2.00 ppm	< 0.002 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.005 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.005 ppm
Die
Substances			0.00700000 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.008 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.008 ppm
	Lead	Pb		< 2.00 ppm	< 0.008 ppm
	Mercury	Hg		< 2.00 ppm	< 0.008 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.020 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.020 ppm
Die Attach Adhesive
Substances			0.00120000 g	ppm	w/avg ppm
	Bromine	Br		< 50.00 ppm	< 0.034 ppm
	Cadmium	Cd		< 2.00 ppm	< 0.001 ppm
	Chlorine	Cl		< 50.00 ppm	< 0.034 ppm
	Flourine	Fl		< 50.00 ppm	< 0.034 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.001 ppm
	Iodine	I		< 50.00 ppm	< 0.034 ppm
	Lead	Pb		< 2.00 ppm	< 0.001 ppm
	Mercury	Hg		< 2.00 ppm	< 0.001 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.003 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.003 ppm
Encapsulation
Substances			1.17200000 g	ppm	w/avg ppm
	Antimony Trioxide	Sb2O3		< 10.00 ppm	< 6.588 ppm
	Bromine	Br		< 50.00 ppm	< 32.942 ppm
	Cadmium	Cd		< 2.00 ppm	< 1.318 ppm
	Chlorine	Cl		< 50.00 ppm	< 32.942 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 1.318 ppm
	Lead	Pb		< 2.00 ppm	< 1.318 ppm
	Mercury	Hg		< 2.00 ppm	< 1.318 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 3.294 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 3.294 ppm
Lead Finish
Substances			0.02470000 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.028 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.028 ppm
	Lead	Pb		< 2.00 ppm	< 0.028 ppm
	Mercury	Hg		< 2.00 ppm	< 0.028 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.069 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.069 ppm
Lead Frame
Substances			0.57222110 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.643 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.643 ppm
	Lead	Pb		< 2.00 ppm	< 0.643 ppm
	Mercury	Hg		< 2.00 ppm	< 0.643 ppm
	Nickel	Ni		= 0.00 ppm	= 0.000 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 1.608 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 1.608 ppm
The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed. RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd. Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel. Weighted average = for part as a whole. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.

Dear Customer:

Please note that, as a supplier of components, we are not required to assess regulatory requirements that may apply to the finished product such as the European RoHS Directive (2003/95/EC), hereinafter referred to as “RoHS”. Please note further that A3958SB-T may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds, if that is your wish.

Allegro MicroSystems, Inc. is a cooperative environmental supplier who fully supports the global environmental initiatives. We value our relationship and we are committed to furthering our cooperation.

Geoffrey H. DesRosiers
Quality Systems Specialist

Allegro MicroSystems, Inc. Materials Declaration Report

Composition Details

Bonding Wire

Die

Die Attach Adhesive

Encapsulation

Lead Finish

Lead Frame