Allegro MicroSystems, Inc.
Materials Declaration Report

Part Number:

A3977KLPTR-T

Package Code:

Lead Count:

Plating:

Package Weight:

0.1083515 g

MSL Rating:

Composition Details

Bonding Wire
Substances			weight	% of material	% of package
	Gold	Au	0.00200310 g	99.99002%	1.84871%
	Misc.		0.00000020 g	0.00995%	0.00018%
	Silver	Ag	0.00000000 g	0.00003%	0.00000%
Total:			0.00200330 g
Die
Substances			weight	% of material	% of package
	Aluminum	Al	0.00008836 g	1.00000%	0.08155%
	Silicon	Si	0.00874754 g	99.00000%	8.07330%
Total:			0.00883590 g
Die Attach Adhesive
Substances			weight	% of material	% of package
	Silver	Ag	0.00165894 g	82.00000%	1.53107%
	Epoxy resin	EP	0.00030347 g	15.00000%	0.28007%
	Misc.		0.00006069 g	3.00000%	0.05601%
Total:			0.00202310 g
Encapsulation
Substances			weight	% of material	% of package
	Epoxy resin	EP	0.00510339 g	7.50000%	4.71003%
	Fused silica	SiO2	0.05783842 g	85.00000%	53.38036%
	Phenolic Resin		0.00510339 g	7.50000%	4.71003%
Total:			0.06804520 g
Lead Finish
Substances			weight	% of material	% of package
	Misc.		0.00000021 g	0.01000%	0.00019%
	Tin	Sn	0.00206189 g	99.99000%	1.90297%
Total:			0.00206210 g
Lead Frame
Substances			weight	% of material	% of package
	Copper	Cu	0.02441739 g	96.20000%	22.53535%
	Iron	Fe	0.00002538 g	0.10000%	0.02343%
	Lead	Pb	0.00000635 g	0.02500%	0.00586%
	Magnesium	Mg	0.00001269 g	0.05000%	0.01171%
	Manganese	Mn	0.00000254 g	0.01000%	0.00234%
	Nickel	Ni	0.00076146 g	3.00000%	0.70277%
	Silicon	Si	0.00009264 g	0.36500%	0.08550%
	Zinc (metal)	Zn	0.00006345 g	0.25000%	0.05856%
Total:			0.02538190 g
For information on "Green" molding compounds, please contact your local sales representative.

RoHS and other substances of concern

Bonding Wire
Substances			0.00200330 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.037 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.037 ppm
	Lead	Pb		< 2.00 ppm	< 0.037 ppm
	Mercury	Hg		< 2.00 ppm	< 0.037 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.092 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.092 ppm
Die
Substances			0.00883590 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.163 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.163 ppm
	Lead	Pb		< 2.00 ppm	< 0.163 ppm
	Mercury	Hg		< 2.00 ppm	< 0.163 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.408 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.408 ppm
Die Attach Adhesive
Substances			0.00202310 g	ppm	w/avg ppm
	Bromine	Br		< 50.00 ppm	< 0.934 ppm
	Cadmium	Cd		< 2.00 ppm	< 0.037 ppm
	Chlorine	Cl		< 50.00 ppm	< 0.934 ppm
	Flourine	Fl		< 50.00 ppm	< 0.934 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.037 ppm
	Iodine	I		< 50.00 ppm	< 0.934 ppm
	Lead	Pb		< 2.00 ppm	< 0.037 ppm
	Mercury	Hg		< 2.00 ppm	< 0.037 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.093 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.093 ppm
Encapsulation
Substances			0.06804520 g	ppm	w/avg ppm
	Antimony Trioxide	Sb2O3		< 2.00 ppm	< 1.256 ppm
	Bromine	Br		< 50.00 ppm	< 31.400 ppm
	Cadmium	Cd		< 2.00 ppm	< 1.256 ppm
	Chlorine	Cl		< 50.00 ppm	< 31.400 ppm
	Flourine	Fl		< 50.00 ppm	< 31.400 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 1.256 ppm
	Iodine	I		< 50.00 ppm	< 31.400 ppm
	Lead	Pb		< 2.00 ppm	< 1.256 ppm
	Mercury	Hg		< 2.00 ppm	< 1.256 ppm
	PFOA	PFOA		< 10.00 ppm	< 6.280 ppm
	PFOS	PFOS		< 10.00 ppm	< 6.280 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 3.140 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 3.140 ppm
Lead Finish
Substances			0.00206210 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.038 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.038 ppm
	Lead	Pb		= 34.00 ppm	= 0.647 ppm
	Mercury	Hg		< 2.00 ppm	< 0.038 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.095 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.095 ppm
Lead Frame
Substances			0.02538190 g	ppm	w/avg ppm
	Cadmium	Cd		< 1.00 ppm	< 0.234 ppm
	Hexavalent Chromium	Cr+6		< 1.00 ppm	< 0.234 ppm
	Lead	Pb		< 5.00 ppm	< 1.171 ppm
	Mercury	Hg		< 2.00 ppm	< 0.469 ppm
	Nickel	Ni		= 30,000.00 ppm	= 7,027.655 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 1.171 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 1.171 ppm
The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed. RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd. Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel. Weighted average = for part as a whole. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.

Dear Customer:

Please note that, as a supplier of components, we are not required to assess regulatory requirements that may apply to the finished product such as the European RoHS Directive (2003/95/EC), hereinafter referred to as “RoHS”. Please note further that A3977KLPTR-T may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds, if that is your wish.

Allegro MicroSystems, Inc. is a cooperative environmental supplier who fully supports the global environmental initiatives. We value our relationship and we are committed to furthering our cooperation.

Geoffrey H. DesRosiers
Quality Systems Specialist

Allegro MicroSystems, Inc. Materials Declaration Report

Composition Details

Bonding Wire

Die

Die Attach Adhesive

Encapsulation

Lead Finish

Lead Frame