Allegro MicroSystems, Inc. Site Map • Contact Us
中文 • English
High-Performance Power and Hall-Effect Sensor ICs

Allegro MicroSystems, Inc.
Materials Declaration Report

Part Number: A3977SEDTR-T
Package Code: ED
Lead Count: 44
Plating: Sn
Package Weight: 2.37912 g
MSL Rating: 3
Lead-free EU RoHS Compliant China RoHS Compliant




Composition Details

Bonding Wire
Substances weight % of material % of package
Gold Au  0.00124988 g 99.99002% 0.05254%
Misc.   0.00000012 g 0.00995% 0.00001%
Silver Ag  0.00000000 g 0.00003% 0.00000%
Total: 0.00125000 g  

Die
Substances weight % of material % of package
Aluminum Al  0.00010000 g 1.00000% 0.00420%
Silicon Si  0.00990000 g 99.00000% 0.41612%
Total: 0.01000000 g  

Die Attach Adhesive
Substances weight % of material % of package
Silver Ag  0.00098400 g 82.00000% 0.04136%
Epoxy resin EP  0.00018000 g 15.00000% 0.00757%
Misc.   0.00003600 g 3.00000% 0.00151%
Total: 0.00120000 g  

Encapsulation
Substances weight % of material % of package
Antimony Trioxide Sb2O3  0.03722320 g 2.00000% 1.56458%
Carbon black C  0.00558348 g 0.30000% 0.23469%
Epoxy resin EP  0.18611600 g 10.00000% 7.82289%
Formaldehyde, polymer with bromophenol and (chloro   0.04652900 g 2.50000% 1.95572%
Phenol, Polymer with Formaldehyde   0.09305800 g 5.00000% 3.91145%
Silica, vitreous Si  1.49265000 g 80.20000% 62.73959%
Total: 1.86116000 g  

Lead Finish
Substances weight % of material % of package
Misc.   0.00000215 g 0.01000% 0.00009%
Tin Sn  0.02146785 g 99.99000% 0.90234%
Total: 0.02147000 g  

Lead Frame
Substances weight % of material % of package
Copper Cu  0.48312030 g 99.81000% 20.30668%
Misc.   0.00019362 g 0.04000% 0.00814%
Zirconium Zr  0.00072606 g 0.15000% 0.03052%
Total: 0.48404000 g  

For information on "Green" molding compounds, please contact your local sales representative.




RoHS and other substances of concern

Bonding Wire
Substances   0.00125000 g ppm w/avg ppm
Cadmium Cd    < 2.00 ppm < 0.001 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.001 ppm
Lead Pb    < 2.00 ppm < 0.001 ppm
Mercury Hg    < 2.00 ppm < 0.001 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.003 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.003 ppm

Die
Substances   0.01000000 g ppm w/avg ppm
Cadmium Cd    < 2.00 ppm < 0.008 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.008 ppm
Lead Pb    < 2.00 ppm < 0.008 ppm
Mercury Hg    < 2.00 ppm < 0.008 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.021 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.021 ppm

Die Attach Adhesive
Substances   0.00120000 g ppm w/avg ppm
Bromine Br    < 50.00 ppm < 0.025 ppm
Cadmium Cd    < 2.00 ppm < 0.001 ppm
Chlorine Cl    < 50.00 ppm < 0.025 ppm
Flourine Fl    < 50.00 ppm < 0.025 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.001 ppm
Iodine I    < 50.00 ppm < 0.025 ppm
Lead Pb    < 2.00 ppm < 0.001 ppm
Mercury Hg    < 2.00 ppm < 0.001 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.003 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.003 ppm

Encapsulation
Substances   1.86116000 g ppm w/avg ppm
Antimony Trioxide Sb2O3    = 20,000.00 ppm = 15,645.780 ppm
Brominated Flame Retardants BFR    = 35,000.00 ppm = 27,380.120 ppm
Cadmium Cd    < 2.00 ppm < 1.565 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 1.565 ppm
Lead Pb    < 2.00 ppm < 1.565 ppm
Mercury Hg    < 2.00 ppm < 1.565 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 3.911 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 3.911 ppm

Lead Finish
Substances   0.02147000 g ppm w/avg ppm
Cadmium Cd    < 2.00 ppm < 0.018 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.018 ppm
Lead Pb    < 2.00 ppm < 0.018 ppm
Mercury Hg    < 2.00 ppm < 0.018 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.045 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.045 ppm

Lead Frame
Substances   0.48404000 g ppm w/avg ppm
Cadmium Cd    < 2.00 ppm < 0.407 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.407 ppm
Lead Pb    = 2.00 ppm = 0.407 ppm
Mercury Hg    < 2.00 ppm < 0.407 ppm
Nickel Ni    = 0.00 ppm = 0.000 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 1.017 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 1.017 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.




Dear Customer:

Please note that, as a supplier of components, we are not required to assess regulatory requirements that may apply to the finished product such as the European RoHS Directive (2003/95/EC), hereinafter referred to as “RoHS”. Please note further that A3977SEDTR-T may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds, if that is your wish.

Allegro MicroSystems, Inc. is a cooperative environmental supplier who fully supports the global environmental initiatives. We value our relationship and we are committed to furthering our cooperation.

Geoffrey H. DesRosiers
Quality Systems Specialist

Copyright © 2010 Allegro MicroSystems, Inc. • 115 Northeast Cutoff, Worcester, MA 01606 USA • Phone: 1.508.853.5000 • Fax: 1.508.853.7895