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High-Performance Power and Hall-Effect Sensor ICs

Allegro MicroSystems, Inc.
Materials Declaration Report

Part Number: A6276ELWTR-T
Package Code: LW
Lead Count: 24
Plating: Sn
Package Weight: 0.6421 g
MSL Rating: 3
Lead-free EU RoHS Compliant China RoHS Compliant




Composition Details

Bonding Wire
Substances weight % of material % of package
Gold Au  0.00073993 g 99.99002% 0.11524%
Misc.   0.00000007 g 0.00995% 0.00001%
Silver Ag  0.00000000 g 0.00003% 0.00000%
Total: 0.00074000 g  

Die
Substances weight % of material % of package
Aluminum Al  0.00008880 g 1.00000% 0.01383%
Silicon Si  0.00879120 g 99.00000% 1.36913%
Total: 0.00888000 g  

Die Attach Adhesive
Substances weight % of material % of package
Silver Ag  0.00091840 g 82.00000% 0.14303%
Epoxy resin EP  0.00016800 g 15.00000% 0.02616%
Misc.   0.00003360 g 3.00000% 0.00523%
Total: 0.00112000 g  

Encapsulation
Substances weight % of material % of package
Carbon black C  0.00144240 g 0.30000% 0.22464%
Epoxy cresol novolac resin   0.00961600 g 2.00000% 1.49759%
Epoxy resin EP  0.02404000 g 5.00000% 3.74397%
Phenolic Resin   0.02404000 g 5.00000% 3.74397%
Silica, vitreous Si  0.42166160 g 87.70000% 65.66914%
Total: 0.48080000 g  

Lead Finish
Substances weight % of material % of package
Misc.   0.00000076 g 0.01000% 0.00012%
Tin Sn  0.00756924 g 99.99000% 1.17883%
Total: 0.00757000 g  

Lead Frame
Substances weight % of material % of package
Copper Cu  0.13926110 g 97.39218% 21.68838%
Iron Fe  0.00336027 g 2.35000% 0.52332%
Lead Pb  0.00000117 g 0.00082% 0.00018%
Phosphorus P  0.00011725 g 0.08200% 0.01826%
Zinc (metal) Zn  0.00025023 g 0.17500% 0.03897%
Total: 0.14299000 g  

For information on "Green" molding compounds, please contact your local sales representative.




RoHS and other substances of concern

Bonding Wire
Substances   0.00074000 g ppm w/avg ppm
Cadmium Cd    < 2.00 ppm < 0.002 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.002 ppm
Lead Pb    < 2.00 ppm < 0.002 ppm
Mercury Hg    < 2.00 ppm < 0.002 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.006 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.006 ppm

Die
Substances   0.00888000 g ppm w/avg ppm
Cadmium Cd    < 5.00 ppm < 0.069 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.028 ppm
Lead Pb    < 5.00 ppm < 0.069 ppm
Mercury Hg    < 2.00 ppm < 0.028 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.069 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.069 ppm

Die Attach Adhesive
Substances   0.00112000 g ppm w/avg ppm
Bromine Br    < 50.00 ppm < 0.087 ppm
Cadmium Cd    < 2.00 ppm < 0.003 ppm
Chlorine Cl    = 195.00 ppm = 0.340 ppm
Flourine Fl    < 50.00 ppm < 0.087 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.003 ppm
Iodine I    < 50.00 ppm < 0.087 ppm
Lead Pb    < 2.00 ppm < 0.003 ppm
Mercury Hg    < 2.00 ppm < 0.003 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.009 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.009 ppm

Encapsulation
Substances   0.48080000 g ppm w/avg ppm
Antimony Trioxide Sb2O3    = 0.00 ppm = 0.000 ppm
Brominated Flame Retardants BFR    = 0.00 ppm = 0.000 ppm
Cadmium Cd    < 2.00 ppm < 1.498 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 1.498 ppm
Lead Pb    < 2.00 ppm < 1.498 ppm
Mercury Hg    < 2.00 ppm < 1.498 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 3.744 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 3.744 ppm

Lead Finish
Substances   0.00757000 g ppm w/avg ppm
Cadmium Cd    < 2.00 ppm < 0.024 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.024 ppm
Lead Pb    = 10.00 ppm = 0.118 ppm
Mercury Hg    < 2.00 ppm < 0.024 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.059 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.059 ppm

Lead Frame
Substances   0.14299000 g ppm w/avg ppm
Cadmium Cd    < 2.00 ppm < 0.445 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.445 ppm
Lead Pb    = 12.00 ppm = 2.672 ppm
Mercury Hg    < 2.00 ppm < 0.445 ppm
Nickel Ni    = 0.00 ppm = 0.000 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 1.113 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 1.113 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.




Dear Customer:

Please note that, as a supplier of components, we are not required to assess regulatory requirements that may apply to the finished product such as the European RoHS Directive (2003/95/EC), hereinafter referred to as “RoHS”. Please note further that A6276ELWTR-T may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds, if that is your wish.

Allegro MicroSystems, Inc. is a cooperative environmental supplier who fully supports the global environmental initiatives. We value our relationship and we are committed to furthering our cooperation.

Geoffrey H. DesRosiers
Quality Systems Specialist

Copyright © 2010 Allegro MicroSystems, Inc. • 115 Northeast Cutoff, Worcester, MA 01606 USA • Phone: 1.508.853.5000 • Fax: 1.508.853.7895