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Technical Publications and Application Notes 
TABLE OF CONTENTS
- General Semiconductor Information
- Hall-Effect Sensor Publications
- Interface Product Publications
- Motor Driver Publications
- Power Conversion/Power Management Publications
- Semiconductor Packaging Publications
- Smoke Detector Publications
General Semiconductor Information
- A Complete Guide to Data Sheets (PDF)
- Product Data Sheet Classifications (PDF)
- A Primer on Essentials of Output Voltage Limitations (PDF)
- Definition of Terms (PDF)
- IC Outputs - Terms and Definitions (PDF)
- MOS vs. Bipolar Transistor Comparison
- Storage of Semiconductor Devices (PDF)
- Electrostatic Protection for Semiconductor Products (PDF)
Hall-Effect Sensor Publications
- Chopper-Stabilized Amplifiers With A Track-And-Hold Demodulator (PDF)
- Hall-Effect IC Applications Guide (PDF)
- Guidelines for Designing Subassemblies Using Hall-Effect Devices (PDF)
- Innovation In Applications-Specific Hall-Effect Transducers Merges Direction-Detection Sensing with Velocity Signals (PDF)
- Magnet Selection Tools - Arnold
- Magnetics Technology Center - Arnold
- Monolithic Magnetic Hall Sensors using Dynamic Quadrature Offset Cancellation (PDF)
- Permanent Magnet Publications - Dexter Magnetic Technologies
- Unipolar Hall-Effect Sensors
- Ring Magnet Speed Sensing for Electronic Power Steering
- Proximity Sensing Programming Technique
- Latching Hall-Effect Sensors
- Vehicle Safety Systems
- Back-Biased Packaging Advances
- Using Allegro Current Sensors in Current Divider Configurations for Extended Measurement Range (PDF)
- Position and Level Sensing Using Hall Effect Sensing Technology (PDF)
- Recent Trends in Hall Effect Current Sensing (PDF)
- Integrating Hall-Effect Magnetic Sensor Technology into Modern Household Appliances (PDF)
- Fully Integrated Hall Effect Motor Driver for Brushless DC Vibration Motor Applications (PDF)
- Micro-Power Position Sensing in Cell Phone Applications
Interface Product Publications
- Power Drive Circuits (PDF)
- A Primer on Driving Incandescent Lamps (PDF)
- "How Do Relays Work?", a Motion Control Magazine article (July/August '99) written by Arnold Offner of Phoenix Contact, Inc.
- VF Display Fundamentals (PDF)
- Constant-Current LED Drivers (PDF)
- Product Replacement for the 58xx Family of Serial-Input, Latched Source Drivers
- Product Replacement for the 58xx Family of Serial-Input, Latched Sink Drivers
- Optimized Control Schemes Improve LED Driver Performance (PDF)
Motor Driver Publications
- A New Microstepping Motor-Driver IC with Integrated Step & Direction Translator Interface (PDF)
- A New, Low-Cost, Dual H-Bridge Motor Driver IC (PDF)
- A New Serial-Controlled Motor Driver IC (PDF)
- Airpax Stepper Motor Handbook
- Compumotor Engineering Reference Guide
- Hurst Manufacturing - Brushless DC and Step Motor Technical Information
- Improving Batwing Power Dissipation (PDF)
- Getting More Out of Your Motor — Motor Driver ICs Integrate More Functions (PDF)
- Monolithic, Programmable, Full-Bridge Motor Driver Integrates PWM Current Control and 'Mixed-Mode' Microstepping (PDF)
- 'Smart', Constant-Torque, Microstepping Drive Circuitry for Under $10 (PDF)
- Three-Phase Motor Controller IC Drives External FETs for PWM Current Control, Synchronous Rectification, and 100% Duty-Cycle Capability (PDF)
- Component Selection for the 3935 Boost Converter (PDF)
- Closed-Loop Speed Control for A3932/36 (PDF)
- Converting A3952 Applications to Use A3953 Devices (PDF)
Power Conversion/Power Management Publications
- Low-Cost Single-Inductor Triple-Output TFT LCD Supply (PDF)
- Series STR-A6100 Flyback Switching Regulators (PDF)
- Series STR-W6750 Off-Line Quasi-Resonant Switching Regulators (PDF)
- Short Duty Cycles Lead to Smaller DC-DC Converters (PDF)
Semiconductor Packaging Publications
- Package Dimensions
- Package Designators (PDF)
- Package Thermal Characteristics (PDF)
- Package Mechanical Characteristics (PDF)
- Soldering Methods for Allegro's Products — SMD and Through-Hole (PDF)
- Guidelines for Designing Subassemblies Using Hall-Effect Devices (PDF)
- Thermal Design for Plastic Integrated Circuits (PDF)
- Back-Biased Packaging Advances
- Application Information: Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages (PDF)