Allegro MicroSystems, Inc.
Materials Declaration Report

Part Number:

UDN2559B-T

Package Code:

Lead Count:

Plating:

Package Weight:

1.1677 g

*Through-hole devices not covered by J-STD-020.

Composition Details

Bonding Wire
Substances			weight	% of material	% of package
	Gold	Au	0.00167683 g	99.99002%	0.14360%
	Misc.		0.00000017 g	0.00995%	0.00001%
	Silver	Ag	0.00000000 g	0.00003%	0.00000%
Total:			0.00167700 g
Die
Substances			weight	% of material	% of package
	Aluminum	Al	0.00006000 g	1.00000%	0.00514%
	Silicon	Si	0.00594000 g	99.00000%	0.50869%
Total:			0.00600000 g
Die Attach Adhesive
Substances			weight	% of material	% of package
	Silver	Ag	0.00098400 g	82.00000%	0.08427%
	Epoxy resin	EP	0.00018000 g	15.00000%	0.01541%
	Misc.		0.00003600 g	3.00000%	0.00308%
Total:			0.00120000 g
Encapsulation
Substances			weight	% of material	% of package
	Carbon black	C	0.00153900 g	0.30000%	0.13180%
	Diantimony-trioxide	Sb2O3	0.01539000 g	3.00000%	1.31798%
	Epoxy cresol novolac resin		0.10260000 g	20.00000%	8.78650%
	Fused silica	SiO2	0.34473600 g	67.20000%	29.52265%
	Phenol, Polymer with Formaldehyde		0.03847500 g	7.50000%	3.29494%
	Phenol, 4,4'-(1-methylethylidene)bis(2,6-dibromo-,		0.01026000 g	2.00000%	0.87865%
Total:			0.51300000 g
Lead Finish
Substances			weight	% of material	% of package
	Misc.		0.00000144 g	0.01000%	0.00012%
	Tin	Sn	0.01439856 g	99.99000%	1.23307%
Total:			0.01440000 g
Lead Frame
Substances			weight	% of material	% of package
	Copper	Cu	0.63022330 g	99.81000%	53.97133%
	Misc.		0.00025257 g	0.04000%	0.02163%
	Zirconium	Zr	0.00094713 g	0.15000%	0.08111%
Total:			0.63142300 g
For information on "Green" molding compounds, please contact your local sales representative.

RoHS and other substances of concern

Bonding Wire
Substances			0.00167700 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.003 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.003 ppm
	Lead	Pb		= 3.00 ppm	= 0.004 ppm
	Mercury	Hg		< 2.00 ppm	< 0.003 ppm
	Polybrominated Biphenyls	PBB		< 10.00 ppm	< 0.014 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 10.00 ppm	< 0.014 ppm
Die
Substances			0.00600000 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.010 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.010 ppm
	Lead	Pb		< 2.00 ppm	< 0.010 ppm
	Mercury	Hg		< 2.00 ppm	< 0.010 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 0.026 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 0.026 ppm
Die Attach Adhesive
Substances			0.00120000 g	ppm	w/avg ppm
	Antimony Trioxide	Sb2O3		< 2.00 ppm	< 0.002 ppm
	Bromine	Br		< 50.00 ppm	< 0.051 ppm
	Cadmium	Cd		< 2.00 ppm	< 0.002 ppm
	Chlorine	Cl		= 133.00 ppm	= 0.137 ppm
	Flourine	Fl		< 50.00 ppm	< 0.051 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.002 ppm
	Iodine	I		< 50.00 ppm	< 0.051 ppm
	Lead	Pb		< 2.00 ppm	< 0.002 ppm
	Mercury	Hg		< 2.00 ppm	< 0.002 ppm
	Polybrominated Biphenyls	PBB		< 10.00 ppm	< 0.010 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 10.00 ppm	< 0.010 ppm
Encapsulation
Substances			0.51300000 g	ppm	w/avg ppm
	Antimony Trioxide	Sb2O3		= 30,000.00 ppm	= 13,179.750 ppm
	Brominated Flame Retardants	BFR		< 30,000.00 ppm	< 13,179.750 ppm
	Cadmium	Cd		< 2.00 ppm	< 0.879 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.879 ppm
	Lead	Pb		< 2.00 ppm	< 0.879 ppm
	Mercury	Hg		< 2.00 ppm	< 0.879 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 2.197 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 2.197 ppm
Lead Finish
Substances			0.01440000 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 0.025 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 0.025 ppm
	Lead	Pb		< 2.00 ppm	< 0.025 ppm
	Mercury	Hg		< 2.00 ppm	< 0.025 ppm
	Polybrominated Biphenyls	PBB		< 10.00 ppm	< 0.123 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 10.00 ppm	< 0.123 ppm
Lead Frame
Substances			0.63142300 g	ppm	w/avg ppm
	Cadmium	Cd		< 2.00 ppm	< 1.081 ppm
	Hexavalent Chromium	Cr+6		< 2.00 ppm	< 1.081 ppm
	Lead	Pb		< 2.00 ppm	< 1.081 ppm
	Mercury	Hg		< 2.00 ppm	< 1.081 ppm
	Nickel	Ni		= 0.00 ppm	= 0.000 ppm
	Polybrominated Biphenyls	PBB		< 5.00 ppm	< 2.704 ppm
	Polybrominated Diphenyl Ethers	PBDE		< 5.00 ppm	< 2.704 ppm
The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed. RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd. Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel. Weighted average = for part as a whole. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.

Dear Customer:

Please note that, as a supplier of components, we are not required to assess regulatory requirements that may apply to the finished product such as the European RoHS Directive (2003/95/EC), hereinafter referred to as “RoHS”. Please note further that UDN2559B-T may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds, if that is your wish.

Allegro MicroSystems, Inc. is a cooperative environmental supplier who fully supports the global environmental initiatives. We value our relationship and we are committed to furthering our cooperation.

Geoffrey H. DesRosiers
Quality Systems Specialist

Allegro MicroSystems, Inc. Materials Declaration Report

Composition Details

Bonding Wire

Die

Die Attach Adhesive

Encapsulation

Lead Finish

Lead Frame