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High-Performance Power and Hall-Effect Sensor ICs

Allegro MicroSystems, Inc.
Materials Declaration Report

Part Number: UDQ2559EBTR-T
Package Code: EB
Lead Count: 28
Plating: Sn
Package Weight: 1.18003 g
MSL Rating: 3
Lead-free EU RoHS Compliant China RoHS Compliant




Composition Details

Bonding Wire
Substances weight % of material % of package
Gold Au  0.00042996 g 99.99002% 0.03644%
Misc.   0.00000004 g 0.00995% 0.00000%
Silver Ag  0.00000000 g 0.00003% 0.00000%
Total: 0.00043000 g  

Die
Substances weight % of material % of package
Aluminum Al  0.00006350 g 1.00000% 0.00538%
Silicon Si  0.00628650 g 99.00000% 0.53274%
Total: 0.00635000 g  

Die Attach Adhesive
Substances weight % of material % of package
Silver Ag  0.00032800 g 82.00000% 0.02780%
Epoxy resin EP  0.00006000 g 15.00000% 0.00508%
Misc.   0.00001200 g 3.00000% 0.00102%
Total: 0.00040000 g  

Encapsulation
Substances weight % of material % of package
Carbon black C  0.00238440 g 0.30000% 0.20206%
Diantimony-trioxide Sb2O3  0.02384400 g 3.00000% 2.02063%
Epoxy cresol novolac resin   0.15896000 g 20.00000% 13.47084%
Fused silica SiO2  0.53410560 g 67.20000% 45.26203%
Phenol, Polymer with Formaldehyde   0.05961000 g 7.50000% 5.05157%
Phenol, 4,4'-(1-methylethylidene)bis(2,6-dibromo-,   0.01589600 g 2.00000% 1.34708%
Total: 0.79480000 g  

Lead Finish
Substances weight % of material % of package
Misc.   0.00000165 g 0.01000% 0.00014%
Tin Sn  0.01644836 g 99.99000% 1.39389%
Total: 0.01645000 g  

Lead Frame
Substances weight % of material % of package
Copper Cu  0.36091290 g 99.81000% 30.58507%
Misc.   0.00014464 g 0.04000% 0.01226%
Zirconium Zr  0.00054240 g 0.15000% 0.04596%
Total: 0.36160000 g  

For information on "Green" molding compounds, please contact your local sales representative.




RoHS and other substances of concern

Bonding Wire
Substances   0.00043000 g ppm w/avg ppm
Cadmium Cd    < 2.00 ppm < 0.001 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.001 ppm
Lead Pb    < 2.00 ppm < 0.001 ppm
Mercury Hg    < 2.00 ppm < 0.001 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.002 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.002 ppm

Die
Substances   0.00635000 g ppm w/avg ppm
Cadmium Cd    < 5.00 ppm < 0.027 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.011 ppm
Lead Pb    < 5.00 ppm < 0.027 ppm
Mercury Hg    < 2.00 ppm < 0.011 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.027 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.027 ppm

Die Attach Adhesive
Substances   0.00040000 g ppm w/avg ppm
Bromine Br    < 50.00 ppm < 0.017 ppm
Cadmium Cd    < 2.00 ppm < 0.001 ppm
Chlorine Cl    = 195.00 ppm = 0.066 ppm
Flourine Fl    < 50.00 ppm < 0.017 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.001 ppm
Iodine I    < 50.00 ppm < 0.017 ppm
Lead Pb    < 2.00 ppm < 0.001 ppm
Mercury Hg    < 2.00 ppm < 0.001 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.002 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.002 ppm

Encapsulation
Substances   0.79480000 g ppm w/avg ppm
Antimony Trioxide Sb2O3    = 30,000.00 ppm = 20,206.270 ppm
Brominated Flame Retardants BFR    = 30,000.00 ppm = 20,206.270 ppm
Cadmium Cd    < 2.00 ppm < 1.347 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 1.347 ppm
Lead Pb    < 2.00 ppm < 1.347 ppm
Mercury Hg    < 2.00 ppm < 1.347 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 3.368 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 3.368 ppm

Lead Finish
Substances   0.01645000 g ppm w/avg ppm
Cadmium Cd    < 2.00 ppm < 0.028 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.028 ppm
Lead Pb    = 10.00 ppm = 0.139 ppm
Mercury Hg    < 2.00 ppm < 0.028 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 0.070 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 0.070 ppm

Lead Frame
Substances   0.36160000 g ppm w/avg ppm
Cadmium Cd    < 2.00 ppm < 0.613 ppm
Hexavalent Chromium Cr+6    < 2.00 ppm < 0.613 ppm
Lead Pb    < 2.00 ppm < 0.613 ppm
Mercury Hg    < 2.00 ppm < 0.613 ppm
Nickel Ni    = 0.00 ppm = 0.000 ppm
Polybrominated Biphenyls PBB    < 5.00 ppm < 1.532 ppm
Polybrominated Diphenyl Ethers PBDE    < 5.00 ppm < 1.532 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.




Dear Customer:

Please note that, as a supplier of components, we are not required to assess regulatory requirements that may apply to the finished product such as the European RoHS Directive (2003/95/EC), hereinafter referred to as “RoHS”. Please note further that UDQ2559EBTR-T may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds, if that is your wish.

Allegro MicroSystems, Inc. is a cooperative environmental supplier who fully supports the global environmental initiatives. We value our relationship and we are committed to furthering our cooperation.

Geoffrey H. DesRosiers
Quality Systems Specialist

Copyright © 2010 Allegro MicroSystems, Inc. • 115 Northeast Cutoff, Worcester, MA 01606 USA • Phone: 1.508.853.5000 • Fax: 1.508.853.7895