New Linear Hall-Effect Sensor ICs with Analog Output In Miniature, Low-Profile Surface-Mount and SIP Packages

AEC-Q100 Qualified and Designed for the Automotive and Industrial Markets

May 30, 2017

A1308-9 Product Image

Allegro MicroSystems, LLC announces two new linear Hall-effect sensor ICs with analog output, targeted at the automotive and industrial markets. New applications for linear output Hall-effect sensor ICs, such as displacement and angular position, require higher accuracy and smaller package sizes. Allegro’s A1308 and A1309 devices have been designed specifically to meet both requirements. Target applications include EPS – torque sensing, EPS – angle sensing, and transmission – fork position sensing. These temperature-stable devices are available in both surface-mount and through-hole packages.

The accuracy of each device is enhanced via end-of-line optimization. Each device features nonvolatile memory to optimize device sensitivity and the quiescent voltage output (QVO: output in the absence of a magnetic field) for a given application or circuit. This A1308 and A1309 optimized performance is sustained across the full operating temperature range by programming the temperature coefficient for both sensitivity and QVO at Allegro end-of-line test. These ratiometric Hall-effect sensor ICs provide a voltage output that is proportional to the applied magnetic field. The quiescent voltage output is adjusted around 50% of the supply voltage.

The features of these linear devices make them ideal for use in automotive and industrial applications requiring high accuracy, and they operate across an extended temperature range, –40°C to 150°C (SOT-23W) or –40°C to 125°C (SIP). Each BiCMOS monolithic circuit integrates a Hall element, temperature-compensating circuitry to reduce the intrinsic sensitivity drift of the Hall element, a small-signal high-gain amplifier, a clamped low-impedance output stage, and a proprietary dynamic offset cancellation technique.

 The A1308 and A1309 sensor ICs are offered in two package styles. The LH is a SOT-23W style, miniature, low-profile package for surface-mount applications. The UA is a 3-pin, ultramini, single inline package (SIP) for through-hole mounting. Both packages are lead (Pb) free, with 100% matte-tin leadframe plating.



Allegro MicroSystems, LLC は、高性能半導体の開発、製造、マーケティングにおけるリーダーです。Allegro の革新的なソリューションは、自動車などの急成長している分野で広く採用されているほか、オフィス オートメーション、工業、コンシューマー/通信市場でも注目されています。Allegro の本社は米国マサチューセッツ州ウースターにあり、設計、アプリケーション、営業サポートなどの拠点を世界中に展開しています。Allegro の詳細については、www.allegromicro.com をご覧ください。

 


記事に関するお問い合わせ:

Stephanie Fennelly
マーケティング広報担当ディレクター
電話: (508) 854-5363
sfennelly@allegromicro.com
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