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The A19520 is an advanced vibration-tolerant Hall-effect integrated circuit (IC) that measures the speed and direction of rotating targets. This sensor IC can directly measure ring magnets or be back-biased with a magnet to measure ferrous targets. The package features an integrated capacitor for electromagnetic compatibility (EMC).
The A19520 employs intelligent algorithms that allow stable operation during vibration and highly dynamic air gap environments common to transmission applications. In addition, the A19520 differential sensing offers inherent rejection of interfering common-mode magnetic fields.
Integrated diagnostics in the A19520 are used to detect an IC failure that impacts the output protocol’s accuracy, providing coverage for functional safety.
The A19520 is provided in a 2-pin miniature SIP package (suffix UB) that is lead (Pb) free, with tin leadframe plating. The UB package includes an IC and capacitor integrated into a single overmolded package, with an additional molded lead-stabilizing bar for robust shipping and ease of assembly.
A19520 was developed in accordance with ISO 26262:2011 as a hardware safety element out of context with ASIL B capability (pending assessment) for use in automotive safety-related systems when integrated and used in the manner prescribed in the applicable safety manual and datasheet.
| Document Type | Document Name |
|---|---|
| Application Note | Giant Magnetoresistance versus Hall-effect: A Comparison of Technologies for Speed Sensor Applications |
| Application Note | Fundamental Properties of Speed Sensors |
| Application Note | Methods and Validation of Stray Magnetic Field Mitigation in Magnetic Speed Sensor ICs |
| Application Note | A19520/ATS19520 Sensor IC Outputs Under Vibration Conditions |
| Application Note | Target Design for Hall Transmission Sensors |
| Application Note | Allegro Microsystems - Chemical Exposure of Devices |
| Application Note | Allegro Hall-Effect Sensor ICs |
| Guide | Hall-Effect IC Applications Guide |
| Guide | Guidelines for Designing Subassemblies Using Hall-Effect Devices |
| Technical Article | Back-Biased Packaging Advances (SE, SG, SH, and SJ versus SA and SB) |
| Technical Article | Soldering Methods for Allegro Products (SMD and Through-Hole) |
