High-Accuracy, Pulse-Width or AK Protocol Hall-Effect Wheel Speed and Direction Sensor IC

A19302

Description

Top Features

Typical Applications

Packaging

The A19302 is an optimized Hall-effect integrated circuit (IC) with the option for PW- or AK-protocol two-wire interface, ideal for applications requiring the determination of speed and direction of the sensed target.

The small package includes an integrated capacitor and Hall-based IC in a single overmolded design, with an additional molded lead-stabilizing bar for robust shipping and ease of assembly. The IC’s SolidSpeed Digital Architecture™ provides highly accurate speed and rotational direction detection. The intelligent algorithms provide signal optimization and compensation capable of maintaining stable operation in the harsh automotive environments common to wheel speed applications.

The A19302 was developed in accordance with ISO 26262 as a hardware safety element out of context with ASIL B(D) capability (pending final assessment) for use in automotive safety-related systems when integrated and used in the manner prescribed in the applicable safety manual and datasheet. The IC includes built-in EEPROM scratch memory available for device traceability throughout sensor module production.

The IC is offered in the UB package, which integrates the IC and a high temperature ceramic capacitor in a single overmolded SIP package for enhanced EMC performance. The 2-pin SIP package is lead (Pb) free, with tin leadframe plating.

  • Hall-effect technology allows ease of use for ring magnet and ferromagnetic target sensing
  • PW or AK Protocol for speed and direction information, signal integrity, and functional status
  • Integrated capacitor in a single overmolded miniature package provides greater EMC robustness
  • SolidSpeed Digital Architecture™ supports advanced algorithms, maintaining pitch accuracy during dynamic air gap disturbances
  • ISO 26262 ASIL B(D) with integrated diagnostics and certified safety design process (pending final assessment)

The IC is offered in the UB package, which integrates the IC and a high temperature ceramic capacitor in a single overmolded SIP package for enhanced EMC performance. The 2-pin SIP package is lead (Pb) free, with tin leadframe plating.

UB Package Documentation

Part Number Specifications and Availability

Documentation and Resources

Documentation

Filter Document Type:
All Types
All Types Application Note
Documents Found: 32