Materials Declaration Report: ATS668LSMTN-T

Part Number: ATS668LSMTN-T
Package Code: SM
Lead Count: 3
Plating: Sn
Package Weight: 0.765426 g
MSL Rating: TBD
Lead-free EU RoHS Compliant China RoHS Compliant


Composition Details

Concentrator
Substances weight % of material % of package
Silicon Si 0.00007000 g 0.25000 % 0.00915 %
Sulfur S 0.00000420 g 0.01500 % 0.00055 %
Chromium Cr 0.00329000 g 11.75000 % 0.42983 %
Total: 0.02800000 g  
Titanium Ti 0.00030800 g 1.10000 % 0.04024 %
Carbon C 0.00000700 g 0.02500 % 0.00091 %
Copper Cu 0.00056000 g 2.00000 % 0.07316 %
Niobium Nb 0.00008400 g 0.30000 % 0.01097 %
Molybdenum Mo 0.00007000 g 0.25000 % 0.00915 %
Total: 0.02800000 g  
Magnet Adhesive / Adhesive Dots
Substances weight % of material % of package
Additive 0.00004800 g 6.00000 % 0.00627 %
Silicon Dioxide O2Si 0.00008800 g 11.00000 % 0.01150 %
Total: 0.00080000 g  
Isobornyl acrylate 0.00012000 g 15.00000 % 0.01568 %
Silicon dioxide, surface treated 0.00025200 g 31.50000 % 0.03292 %
Phenyl Methacrylate 0.00008800 g 11.00000 % 0.01150 %
2,5-Furandione, polymer with 1,3-butadiene 0.00004800 g 6.00000 % 0.00627 %
Total: 0.00080000 g  
(2,4,6-trioxo-1,3,5-triazine-1,3,5(2H,4H,6H)-triyl 0.00002400 g 3.00000 % 0.00314 %
Dihexyl fumarate 0.00013200 g 16.50000 % 0.01725 %
Total: 0.00080000 g  
Passive Attachment
Substances weight % of material % of package
Antimony/Antimony compounds Sb2O3 0.00003409 g 4.87000 % 0.00445 %
Misc. 0.00003829 g 5.47000 % 0.00500 %
Tin Sn 0.00062762 g 89.66000 % 0.08200 %
Concentrator Attach Adhesive
Substances weight % of material % of package
Bismaleimide resin 0.00028700 g 41.00000 % 0.03750 %
Total: 0.00070000 g  
Additive 0.00002800 g 4.00000 % 0.00366 %
Polytetrafloroethylene 0.00029400 g 42.00000 % 0.03841 %
Concentrator
Substances weight % of material % of package
Phosphorus (wht/yellow) P 0.00000560 g 0.02000 % 0.00073 %
Nickel Ni 0.00238000 g 8.50000 % 0.31094 %
Manganese Mn 0.00007000 g 0.25000 % 0.00915 %
Iron Fe 0.02115120 g 75.54000 % 2.76332 %
Bonding Wire
Substances weight % of material % of package
Copper Cu 0.00000000 g 0.00290 % 0.00000 %
Misc. 0.00000000 g 0.00097 % 0.00000 %
Gold Au 0.00005000 g 99.99323 % 0.00653 %
Silver Ag 0.00000000 g 0.00290 % 0.00000 %
Lead Finish
Substances weight % of material % of package
Tin Sn 0.00859914 g 99.99000 % 1.12345 %
Misc. 0.00000086 g 0.01000 % 0.00011 %
Total: 0.00860000 g  
Die Attach Adhesive
Substances weight % of material % of package
Calcium Carbonate CaCO3 0.00010500 g 35.00000 % 0.01372 %
Epoxy Resin / Basic Durometer EP 0.00018150 g 60.50000 % 0.02371 %
Zinc Oxide ZnO 0.00000750 g 2.50000 % 0.00098 %
Misc. 0.00000600 g 2.00000 % 0.00078 %
Die
Substances weight % of material % of package
Silicon Si 0.00627281 g 99.60000 % 0.81952 %
Aluminum Al 0.00002519 g 0.40000 % 0.00329 %
Encapsulation
Substances weight % of material % of package
Silicon Dioxide O2Si 0.01848700 g 6.95000 % 2.41526 %
Phenol Resin 0.01050700 g 3.95000 % 1.37270 %
Total: 0.26600000 g  
Epoxy Resin / Basic Durometer EP 0.01848700 g 6.95000 % 2.41526 %
Carbon C 0.00172900 g 0.65000 % 0.22589 %
Fused silica SiO2 0.21679000 g 81.50000 % 28.32279 %
Total: 0.26600000 g  
Leadframe
Substances weight % of material % of package
Copper Cu 0.14451910 g 99.87500 % 18.88088 %
Zirconium Zr 0.00012661 g 0.08750 % 0.01654 %
Misc. 0.00005426 g 0.03750 % 0.00709 %
Concentrator Attach Adhesive
Substances weight % of material % of package
Polybutadiene 0.00009100 g 13.00000 % 0.01189 %
Total: 0.00070000 g  
Internal Leadframe Finish
Substances weight % of material % of package
Silver Ag 0.00335664 g 99.90000 % 0.43853 %
Sulfur S 0.00000168 g 0.05000 % 0.00022 %
Carbon C 0.00000168 g 0.05000 % 0.00022 %
Total: 0.00336000 g  
Magnet Nd-Fe 1st Layer
Substances weight % of material % of package
Cobalt Co 0.00301800 g 1.00000 % 0.39429 %
Iron Fe 0.19435920 g 64.40000 % 25.39230 %
Misc. 0.00301800 g 1.00000 % 0.39429 %
Copper Cu 0.00060360 g 0.20000 % 0.07886 %
Praseodym Pr 0.01690080 g 5.60000 % 2.20803 %
Neodymium Nd 0.07514820 g 24.90000 % 9.81783 %
Dysprosium Dy 0.00482880 g 1.60000 % 0.63086 %
Terbium Tb 0.00090540 g 0.30000 % 0.11829 %
Boron B 0.00301800 g 1.00000 % 0.39429 %
Total: 0.30180000 g  

For information on "Green" molding compounds, please contact your local sales representative.





RoHS and other substances of concern

Bonding Wire
Substances 0.00005000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.003 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.003 ppm
Cadmium Cd   < 2 ppm < 0.000 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.003 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.003 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.000 ppm
Lead Pb   < 2 ppm < 0.000 ppm
Mercury Hg   < 2 ppm < 0.000 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.000 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.000 ppm
Concentrator
Substances 0.02800000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 1.829 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 1.829 ppm
Cadmium Cd   < 2 ppm < 0.073 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 1.829 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 1.829 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.073 ppm
Lead Pb   < 2 ppm < 0.073 ppm
Mercury Hg   < 2 ppm < 0.073 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.183 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.183 ppm
Concentrator Attach Adhesive
Substances 0.00070000 g ppm w/avg ppm
Beryllium Be   < 2 ppm < 0.002 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.046 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.046 ppm
Cadmium Cd   < 2 ppm < 0.002 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.046 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.046 ppm
Hexabromocyclododecane (Flame Retardant) HBCDD   < 5 ppm < 0.005 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.002 ppm
Lead Pb   < 2 ppm < 0.002 ppm
Mercury Hg   < 2 ppm < 0.002 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.005 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.005 ppm
Die
Substances 0.00629800 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.411 ppm
Bromine Br   < 50 ppm < 0.411 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.411 ppm
Cadmium Cd   < 2 ppm < 0.016 ppm
Chlorine Cl   < 50 ppm < 0.411 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.411 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.411 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.016 ppm
Iodine I   < 50 ppm < 0.411 ppm
Lead Pb   < 2 ppm < 0.016 ppm
Mercury Hg   < 2 ppm < 0.016 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.041 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.041 ppm
Die Attach Adhesive
Substances 0.00030000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.020 ppm
Bromine Br   < 50 ppm < 0.020 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.020 ppm
Cadmium Cd   < 2 ppm < 0.001 ppm
Chlorine Cl   = 274 ppm = 0.107 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.020 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.020 ppm
Flourine Fl   < 50 ppm < 0.020 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.001 ppm
Iodine I   < 50 ppm < 0.020 ppm
Lead Pb   < 2 ppm < 0.001 ppm
Mercury Hg   < 2 ppm < 0.001 ppm
Polybrominated Biphenyls PBB   < 50 ppm < 0.020 ppm
Polybrominated Diphenyl Ethers PBDE   < 50 ppm < 0.020 ppm
Encapsulation
Substances 0.26600000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 17.376 ppm
Bromine Br   < 50 ppm < 17.376 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 17.376 ppm
Cadmium Cd   < 2 ppm < 0.695 ppm
Chlorine Cl   < 50 ppm < 17.376 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 17.376 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 17.376 ppm
Flourine Fl   < 50 ppm < 17.376 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.695 ppm
Iodine I   < 50 ppm < 17.376 ppm
Lead Pb   < 2 ppm < 0.695 ppm
Mercury Hg   < 2 ppm < 0.695 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.738 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.738 ppm
Internal Leadframe Finish
Substances 0.00336000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.219 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.219 ppm
Cadmium Cd   < 2 ppm < 0.009 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.219 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.219 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.009 ppm
Lead Pb   = 5 ppm = 0.022 ppm
Mercury Hg   < 2 ppm < 0.009 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.022 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.022 ppm
Lead Finish
Substances 0.00860000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 13 ppm < 0.146 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 13 ppm < 0.146 ppm
Cadmium Cd   < 2 ppm < 0.022 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 13 ppm < 0.146 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 13 ppm < 0.146 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.022 ppm
Lead Pb   = 16 ppm = 0.180 ppm
Mercury Hg   < 2 ppm < 0.022 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.056 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.056 ppm
Leadframe
Substances 0.14470000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 10 ppm < 1.890 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 9.452 ppm
Bromine Br   < 50 ppm < 9.452 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 9.452 ppm
Cadmium Cd   < 2 ppm < 0.378 ppm
Chlorine Cl   < 50 ppm < 9.452 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 9.452 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 9.452 ppm
Flourine Fl   < 50 ppm < 9.452 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.378 ppm
Iodine I   < 50 ppm < 9.452 ppm
Lead Pb   = 4 ppm = 0.756 ppm
Mercury Hg   < 2 ppm < 0.378 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.945 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.945 ppm
Magnet Adhesive / Adhesive Dots
Substances 0.00080000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   < 2 ppm < 0.002 ppm
Beryllium Be   < 2 ppm < 0.002 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 0.052 ppm
Bromine Br   < 50 ppm < 0.052 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 0.052 ppm
Cadmium Cd   < 2 ppm < 0.002 ppm
Chlorine Cl   = 127 ppm = 0.133 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 0.052 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 0.052 ppm
Hexabromocyclododecane (Flame Retardant) HBCDD   < 5 ppm < 0.005 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.002 ppm
Lead Pb   < 2 ppm < 0.002 ppm
Mercury Hg   < 2 ppm < 0.002 ppm
PFOA PFOA   < 10 ppm < 0.010 ppm
PFOS PFOS   < 10 ppm < 0.010 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 0.005 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 0.005 ppm
Magnet Nd-Fe 1st Layer
Substances 0.30180000 g ppm w/avg ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 50 ppm < 19.715 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 50 ppm < 19.715 ppm
Cadmium Cd   < 2 ppm < 0.789 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 50 ppm < 19.715 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 50 ppm < 19.715 ppm
Hexavalent Chromium Cr+6   < 2 ppm < 0.789 ppm
Lead Pb   < 2 ppm < 0.789 ppm
Mercury Hg   < 2 ppm < 0.789 ppm
Polybrominated Biphenyls PBB   < 5 ppm < 1.971 ppm
Polybrominated Diphenyl Ethers PBDE   < 5 ppm < 1.971 ppm
Passive Attachment
Substances 0.00070000 g ppm w/avg ppm
Antimony Trioxide Sb2O3   = 43200 ppm = 39.507 ppm
Bis (2-ethylhexyl) Phthalate CAS 117-81-7 DEHP   < 200 ppm < 0.183 ppm
Bromine Br   < 10 ppm < 0.009 ppm
Butyl benzyl Phthalate CAS 85-68-7 BBP   < 100 ppm < 0.091 ppm
Cadmium Cd   < 10 ppm < 0.009 ppm
Chlorine Cl   < 10 ppm < 0.009 ppm
Dibutylphthalate CAS 84-74-2 DBP   < 100 ppm < 0.091 ppm
Diisobutyl Phthalate CAS 84-69-53 DIBP   < 100 ppm < 0.091 ppm
Flourine Fl   < 10 ppm < 0.009 ppm
Hexavalent Chromium Cr+6   < 10 ppm < 0.009 ppm
Iodine I   < 10 ppm < 0.009 ppm
Lead Pb   = 93 ppm = 0.085 ppm
Mercury Hg   < 5 ppm < 0.005 ppm
Polybrominated Biphenyls PBB   < 300 ppm < 0.274 ppm
Polybrominated Diphenyl Ethers PBDE   < 300 ppm < 0.274 ppm

The less than (<) symbol is used to indicate that the test results are below the amounts indicated, which are the minimum detection limits of the laboratory performing the testing. The exception to this is for plating containing lead, where the maximum amount of lead is listed.
RoHS maximum limits (ppm): 1000 for Pb, Hg, Cr6+, PBB, PBDE (exemption: lead if solderballs are used.) 100 for Cd.
Reportable substances (if present): Antimony Trioxide, Brominated Flame Retardants, Nickel.
Weighted average = for part as a whole.

The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use. The user is cautioned to verify that the information being relied upon is current.





As a supplier of components, we are not required to assess regulatory requirements (such as the European RoHS Directive (2011/65/EU) - hereinafter referred to as RoHS) that apply to finished product. Please note further that product may contain small amounts of lead. Therefore, we cannot make representations, warranties or indemnities regarding the complete absence of lead in the finished product.

You will note that, if there is sufficient volume and the above referenced product is not below RoHS allowable thresholds, we are prepared to discuss making a product listed by Allegro that is below RoHS allowable thresholds.

Allegro MicroSystems, LLC is a cooperative environmental supplier who fully supports global environmental initiatives. We value our customer relationships and are committed to provide the highest levels of quality standards.

Geoffrey H. DesRosiers
Quality Systems Specialist

.

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