Allegro MicroSystems, Inc. Introduces a New, Revolutionary Package Option For Their Existing Current Sensor IC Portfolio

Designed for High and Low Side Sensing Applications

February 26, 2013

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Worcester, MA – Allegro MicroSystems, Inc. introduces a revolutionary new package offering for Allegro’s current sensor IC family of devices. Allegro’s smallest current sensor linear IC, the ACS711, is now housed in a 0.75 mm thick low profile QFN package measuring only 3 mm x 3 mm. This new micro sized device is possibly the smallest fully integrated linear current sensor IC in the world! With only a 0.6 mΩ internal resistance, this package can really take the heat. With proper PCB design, the device can be used for applications with over 30 A continuous current while reducing power consumption by an order of magnitude over existing sense resistor op-amp solutions.

Factory programming provides for high accuracy in this IC with an integrated fast response fault output. Together these techniques deliver the smallest current sensing footprint available for your application without compromising accuracy. It is designed for low-side or high side sensing applications up to 100 VDC. High accuracy is achieved through factory end of line trimming. When combined with our ratiometry feature, our device offers superior accuracy compared to other shunt and op amp solutions on the market today.

Allegro’s new current sensor IC is targeted at the industrial and white goods markets with end applications to include motor and pump control in white goods, short circuit and overpower detection in audio applications, lighting and general power supply monitoring.

Allegro MicroSystems is redefining the future of power and sensing technologies. From green energy to advanced mobility and motion control systems, our team is passionate about developing intelligent solutions that move the world forward and give our customers a competitive edge. With global engineering, manufacturing and support, Allegro is a trusted partner to both large enterprises and regional market leaders worldwide. Visit

Editorial Contact:

Nicole Bump
Senior Manager, Marketing Communication
Tel: (603) 314-1586
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