Allegro MicroSystems, LLC Introduces New 0° To 360° Angle Sensor ICs

The A1330 Devices Support Either Analog or PWM Output Signals for Ease of Integration

December 5, 2017

A1330 Product Image

Allegro MicroSystems, LLC introduces a new 0° to 360° angle sensor ICs that provide contactless high-resolution angular position information based on magnetic Circular Vertical Hall (CVH) technology. Allegro’s A1330 devices include a system-on-chip (SoC) architecture that includes: a CVH front end, digital signal processing, and either an analog or digital PWM output signal. The A1330 is offered in both single and dual die versions for systems that require redundant sensors. They also include on-chip EEPROM technology, capable of supporting up to 100 read/write cycles, for flexible end-of-line programming of calibration parameters. Both devices are ideal for automotive applications requiring 0° to 360° angle measurements, such as motor position measurements for pumps and other actuators, that require low latency and high resolution. The A1330 also includes on-chip scaling to support “short stroke” applications with as little as 11.25° of motion, like valve position, pedal position, and fuel tank level sensing.

The stacked die nature of the dual die assembly provides better channel to channel matching than more traditional side by side assembly techniques. This is a key parameter for safety critical applications where the output of the two sensors is compared to insure that the system is operating safely. Both the single and dual die versions of the A1330 are offered in a low profile, (Pb) free, 100% matte-tin leadframe plated 8-pin TSSOP package.



Allegro MicroSystems is redefining the future of power and sensing technologies. From green energy to advanced mobility and motion control systems, our team is passionate about developing intelligent solutions that move the world forward and give our customers a competitive edge. With global engineering, manufacturing and support, Allegro is a trusted partner to both large enterprises and regional market leaders worldwide. Visit www.allegromicro.com.


Editorial Contact:

Nicole Bump
Senior Manager, Marketing Communication
Tel: (603) 314-1586
nbump@allegromicro.com
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