Sensor IC Package Portfolio | Allegro MicroSystems

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Sensor ICs

Allegro MicroSystems is a leader in developing, manufacturing and marketing high-performance semiconductors. Allegro's innovative solutions serve high-growth applications within the automotive market, with additional focus on office automation, industrial, and consumer/communications solutions. The development of Allegro sensor ICs not only includes leading edge innovations in the area of integrated circuit design but also includes application specific innovation in the area of custom package design.

A small sampling of Allegro’s custom packaging developments include:

Proprietary, integrated magnet packages that simplify magnetic system design in automotive speed sensing applications. See the SE, SG, SH and SJ packages.

Revolutionary, integrated current sensing packages with high bandwidth magnetic design features. See the SOIC, QSOP, EX, and CA/CB packages with integrated, low resistance current conductors and the 1 mm thick KT package.

Small footprint, low profile DFN packages for communications and consumer products. See the EW and CG packages.

To view a sampling of Allegro’s most recent, high technology packages click here.