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The ARG81402 is designed to provide power to loads such as microprocessors, sensors, and communication transceivers, and is ideal for both Automotive and Industrial applications.The device is in a small footprint 5x5mm package, and offers a high level of integration, including:
The ARG81402 is supplied in a low-profile 32-lead, 5 mm × 5 mm, 0.5 mm pitch QFN package (suffix “ET”) with exposed thermal pad and wettable flank to allow solder joint inspection.
ARG81402 was developed in accordance with ISO 26262:2011 as a hardware safety element out of context with ASIL D capability (pending assessment) for use in automotive safety-related systems when integrated and used in the manner prescribed in the applicable safety manual and datasheet.