| Document Type | Document Name |
|---|---|
| Application Note | Thermal Design for Plastic Integrated Circuits |
| Application Note | Package Thermal Characteristics |
| Application Note | Packaging Designators |
| Application Note | Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages |
| Application Note | Allegro Microsystems - Chemical Exposure of Devices |
| Guide | Guidelines for Designing Subassemblies Using Hall-Effect Devices |
| Selection Guide | Allegro Product Selection Guide |
