Document Type | Document Name |
---|---|
Application Note | Thermal Design for Plastic Integrated Circuits |
Application Note | Package Thermal Characteristics |
Application Note | Packaging Designators |
Application Note | Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages |
Application Note | Allegro Microsystems - Chemical Exposure of Devices |
Guide | Guidelines for Designing Subassemblies Using Hall-Effect Devices |
Selection Guide | Allegro Product Selection Guide |