传感器 IC 封装组合

A small sampling of Allegro’s custom packaging developments include:

• Proprietary, integrated magnet packages that simplify magnetic system design in automotive speed sensing applications. See the SE, SG, SH and SJ packages.
• Revolutionary, integrated current sensing packages with high bandwidth magnetic design features. See the SOIC, QSOP, EX, and CA/CB packages with integrated, low resistance current conductors and the 1 mm thick KT package.
• Small footprint, low profile DFN packages for communications and consumer products. See the EW and CG packages.

To view a sampling of Allegro’s most recent, high technology packages click here.