封装选择指南
Use the selection guide below to find and download specific package information.
ALLEGRO MICROSYSTEMS, LLC STRIVES TO ENSURE THE ACCURACY AND COMPLETENESS OF THE INFORMATION PROVIDED IN THESE OUTLINE DRAWINGS AND THERMAL CHARACTERISTIC FILES. HOWEVER, INFORMATION CONTAINED IN THESE FILES IS INTENDED ONLY FOR REFERENCE PURPOSES. IT IS THE RESPONSIBILITY OF THE USER TO AUTHENTICATE ANY INFORMATION PROVIDED IN THESE OUTLINE DRAWINGS AND THERMAL CHARACTERISTIC FILES BY COMPARING SUCH INFORMATION WITH THE CORRESPONDING INFORMATION OF THE APPROPRIATE ALLEGRO PRODUCT DATASHEET.
Package Application Notes (PDF)
- Soldering Methods for Allegro's Products — SMD and Through-Hole
- Guidelines for Designing Subassemblies Using Hall-Effect Devices
- Procedure for Measuring Pad-to-Ambient Thermal Resistance (RθPA) for Exposed Pad Packages
- Leadforming Using Back-Biased Hall-Effect Devices
- Chemical Exposure of Devices