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Interaction between a semiconductor circuit and its package can significantly affect product performance. Critical characteristics of the package include the ability to dissipate heat, and to withstand vibration, shock, high temperature, high humidity, and other environmental conditions. Our packaging portfolio continues to evolve to meet the demands for more highly integrated products with smaller footprints, thinner profiles, and more input/output pins per package.
ALLEGRO MICROSYSTEMS, LLC STRIVES TO ENSURE THE ACCURACY AND COMPLETENESS OF THE INFORMATION PROVIDED IN THESE OUTLINE DRAWINGS AND THERMAL CHARACTERISTIC FILES. HOWEVER, INFORMATION CONTAINED IN THESE FILES IS INTENDED ONLY FOR REFERENCE PURPOSES. IT IS THE RESPONSIBILITY OF THE USER TO AUTHENTICATE ANY INFORMATION PROVIDED IN THESE OUTLINE DRAWINGS AND THERMAL CHARACTERISTIC FILES BY COMPARING SUCH INFORMATION WITH THE CORRESPONDING INFORMATION OF THE APPROPRIATE ALLEGRO PRODUCT DATASHEET.