Power IC Package Portfolio
Integrated Circuits
Allegro MicroSystems is a leader in developing, manufacturing and marketing high-performance semiconductors. Allegro's innovative solutions serve high-growth applications within the automotive market, with additional focus on office automation, industrial, and consumer/communications solutions.
Allegro’s power IC packages offer industry-leading thermal performance with limited board space.
- TSSOP – Industry-standard TSSOP with optional exposed pad for enhanced thermal performance
- QFP – Universal quad flat pack with exposed pad for enhanced thermal performance
- QFN/TDFN – Quad and dual, low-profile, surface-mount packages with exposed pad for enhanced thermal performance (wettable flank options available)
- MSOP – Industry-standard miniature small outline package with optional exposed pad for enhanced thermal performance
- SOIC – Small outline integrated circuit with optional exposed pad for enhanced thermal performance
- CSP – Wafer level chip scale
Additional industry-standard packaging options are available to meet individual design requirements.
To view a sampling of Allegro’s most recent, high technology packages click here.