Quality Standards and Environmental Certifications
English
中文(中国)
日本語 (日本)
Careers
Contact Us
Newsletter
Go
Go
Products
Sense
Current Sensors
Switches and Latches
Position Sensors
Speed Sensors
Interface ICs
Photonics
Regulate
Regulators
ClearPower Modules
LED Drivers
Drive
BLDC Drivers
Brush DC Drivers
Stepper Motor Drivers
Applications
Automotive
Hybrid and EV Solutions
Conventional Powertrain
Safety and ADAS
Comfort
Industrial
Industrial Transportation and Personal Mobility
Building and Factory
Industrial Motor Control
Garden and Power Tools
Energy and Infrastructure
Charging Infrastructure
Datacenter & Telecom
Power Supply
Solar Energy
Consumer
Major Appliances
Small Appliances
Residential HVAC
Gaming
Computers and Printing
Design Support
Design and Development
Evaluation Kits and Demo Boards
Packaging
Quality and Environment
Software Portal
Resources
About Allegro
Our Company
What We Do
Our Leadership
Newsroom
Careers
Current Openings
Corporate Responsibility
Sustainability
Our People
Community
Contact Us
Our Locations
Sales and Distributors
Technical Assistance
Investors
Products
Products
Sense
Sense
Current Sensors
Current Sensors
Current Sensors Innovations
FAQ
0 to 400 A Integrated Current Sensor ICs
Field Sensors 0 to >1000 A Sensor ICs
0 to 50 A Integrated Current Sensor ICs
Switches and Latches
Switches and Latches
Hall-Effect Latches and Bipolar Switches
Dual Hall-Effect Latches
Three-Wire Hall-Effect Switches
Two-Wire Hall-Effect Switches
Micropower Hall-Effect Switches
Special Purpose Devices
Position Sensors
Position Sensors
3D Magnetic
2D Angle
1D Linear
Speed Sensors
Speed Sensors
Camshaft
Crankshaft
Special Purpose
Transmission
Wheel Speed
Interface ICs
Interface ICs
Sensor Interface
Smoke ICs
Smoke ICs
A5303, A5358, A5366
A5348-A5367
Photonics
Regulate
Regulate
Regulators
Regulators
Industrial Regulators
Multiple Output Regulators
Single Output Regulators
ClearPower Modules
ClearPower Modules
LED Driver Modules
LED Drivers
LED Drivers
LED Drivers For Backlighting
LED Drivers For Lighting
Drive
Drive
BLDC Drivers
Brush DC Drivers
Stepper Motor Drivers
Applications
Applications
Automotive
Automotive
Hybrid and EV Solutions
Hybrid and EV Solutions
Battery Management Systems
Cooling Systems
DC-DC Converters
eTurbo Supercharger
Engine Cooling Fans, Pumps and Compressors
Inverter Systems
On-Board Chargers
PTC Heaters
Starter Generators
EV Transmissions
Conventional Powertrain
Conventional Powertrain
Cooling Fans
Engine Management
Pump Systems
Transmission
Safety and ADAS
Safety and ADAS
Braking
Braking
ABS-VSC
Electric Parking Brake
Electrohydraulic
Electromechanical
Detection and Ranging
Driver Monitoring Systems
Electric Power Steering
Head-up Display
Lighting
Seatbelt
Seat Position
Steer-by-Wire
Comfort
Comfort
HVAC Systems
In-Cabin Motors
Infotainment
Industrial
Industrial
Industrial Transportation and Personal Mobility
Industrial Transportation and Personal Mobility
2-Wheeler
e-Bikes and Pedelec
ICE Motorcycle and Scooter
Building and Factory
Building and Factory
Building Automation
Factory Automation
Security/Surveillance
Industrial Motor Control
Garden and Power Tools
Energy and Infrastructure
Energy and Infrastructure
Charging Infrastructure
Datacenter & Telecom
Power Supply
Solar Energy
Consumer
Consumer
Major Appliances
Small Appliances
Residential HVAC
Gaming
Computers and Printing
Design Support
Design Support
Design and Development
Evaluation Kits and Demo Boards
Packaging
Quality and Environment
Software Portal
Resources
About Allegro
About Allegro
Our Company
Our Company
What We Do
Our Leadership
Newsroom
Careers
Careers
Current Openings
Corporate Responsibility
Corporate Responsibility
Sustainability
Our People
Community
Contact Us
Contact Us
Our Locations
Sales and Distributors
Technical Assistance
Investors
English
中文(中国)
日本語 (日本)
GO
GO
Close
Menu
Semiconductor Packaging Publications
Back-Biased Packaging Advances
Chemical Exposure of Devices
Guidelines for Designing Subassemblies Using Hall-Effect Devices
Soldering Methods for Allegro Products (SMD and Through-Hole)
Wettable Flank Plated PQFN
Homepage
Insights and Innovations
Semiconductor Packaging Publications
Semiconductor Packaging Publications
Package Designators
(PDF)
Package Dimensions
Package Thermal Characteristics
(PDF)
Back-Biased Packaging Advances
Chemical Exposure of Devices
Guidelines for Designing Subassemblies Using Hall-Effect Devices
(PDF)
Improving Batwing Power Dissipation
(PDF)
Procedure for Measuring Pad-to-Ambient Thermal Resistance (R
θPA
) for Exposed Pad Packages
(PDF)
Soldering Methods for Allegro's Products — SMD and Through-Hole
Thermal Design for Plastic Integrated Circuits
(PDF)
Wettable Flank Plated PQFN
Guidelines for Leadforming Using Back-Biased Hall-Effect Devices
