Quality Standards and Environmental Certifications
English
中文(中华人民共和国)
Careers
Contact Us
Go
Go
Menu
Products
Sense
Current Sensing
Switches and Latches
Linear and Angular Position
Magnetic Speed
Regulate
Regulators
LED Drivers
Drive
BLDC Drivers
Brush DC and Stepper Drivers
Sanken Products
ACS71020
LEARN MORE
Applications
Automotive
Hybrid EV Solutions
Conventional Powertrain
Safety and ADAS
Comfort
Consumer
Entertainment and Gaming
White Goods
Computer
PCs and Laptops
Servers
Industrial
Personal Mobility
Building and Factory
Energy Efficient Systems
Medical Instrumentation
Industrial Motor Control
Power Tools
Design Support
Sample Requests
Evaluation Kits and Demo Boards
ASEK-02: Allegro Sensor Evaluation Kit
ASEK-05: Allegro Sensor Evaluation Kit
ASEK-20: Allegro Sensor Evaluation Kit
Packaging
Quality and Environment
FAQ
Technical Assistance
About Allegro
Our Leadership
Newsroom
Events
Careers
Contact Us
Our Locations
Sales Offices and Distributors
Technical Assistance
Insights and Innovations
Products
Products
Sense
Sense
Current Sensing
Current Sensing
Fifty To Two Hundred Amp Integrated Conductor Sensor ICs
SIP Package Zero To Thousand Amp Sensor ICs
0 to 50 A Integrated Current Sensor ICs
Switches and Latches
Switches and Latches
Hall Effect Latches Bipolar Switches
Dual Hall-Effect Latches
Three Wire Hall Effect Switches
Two Wire Hall Effect Switches
Micropower Switches Latches
Special Purpose Devices
Linear and Angular Position
Linear and Angular Position
Angular Position Sensor ICs
Linear Position Sensor ICs
Magnetic Speed
Magnetic Speed
Camshaft Sensor ICs
Crankshaft Sensor ICs
General Purpose Speed Sensor ICs
Transmission Sensor ICs
Wheel Speed Sensor ICs
Regulate
Regulate
Regulators
Regulators
Multiple Output Regulators
Single Output Regulators
LED Drivers
LED Drivers
LED Drivers For Backlighting
LED Drivers For Lighting
Drive
Drive
BLDC Drivers
Brush DC and Stepper Drivers
Sanken Products
ACS71020
LEARN MORE
Applications
Applications
Automotive
Automotive
Hybrid EV Solutions
Hybrid EV Solutions
Cooling Systems
DC/DC Converters and Charging
Inverter Systems
Conventional Powertrain
Conventional Powertrain
Cooling Fans
Engine Management
Pump Systems
Transmission
Safety and ADAS
Safety and ADAS
Anti-Lock Brake Stability Control
Electric Parking Brake
Electric Power Steering
Lighting
Lighting
Interior & Exterior Automotive LED Lighting Solutions
Seatbelt
Seat Position
Comfort
Comfort
HVAC Systems
In-Cabin Motors
Infotainment
Lighting
Consumer
Consumer
Entertainment and Gaming
White Goods
White Goods
Small Appliances
Smart Appliances
Computer
Computer
PCs and Laptops
Servers
Industrial
Industrial
Personal Mobility
Personal Mobility
2-Wheeler
e-Bikes
Building and Factory
Building and Factory
Building Automation
Robotics and Manufacturing Automation
Security/Surveillance
Energy Efficient Systems
Energy Efficient Systems
Renewable Energy
Smart Meters
Medical Instrumentation
Industrial Motor Control
Power Tools
Design Support
Design Support
Sample Requests
Evaluation Kits and Demo Boards
Evaluation Kits and Demo Boards
ASEK-02: Allegro Sensor Evaluation Kit
ASEK-05: Allegro Sensor Evaluation Kit
ASEK-20: Allegro Sensor Evaluation Kit
Packaging
Quality and Environment
Quality and Environment
FAQ
Technical Assistance
About Allegro
About Allegro
Our Leadership
Newsroom
Events
Careers
Contact Us
Contact Us
Our Locations
Sales Offices and Distributors
Technical Assistance
Insights and Innovations
English
中文(中华人民共和国)
GO
GO
Close
Menu
Semiconductor Packaging Publications
Back-Biased Packaging Advances
Chemical Exposure of Devices
Guidelines for Designing Subassemblies Using Hall-Effect Devices
GeneralPage
AN269119
Homepage
Insights and Innovations
Semiconductor Packaging Publications
Semiconductor Packaging Publications
Package Designators
(PDF)
Package Dimensions
Package Thermal Characteristics
(PDF)
Back-Biased Packaging Advances
Chemical Exposure of Devices
Guidelines for Designing Subassemblies Using Hall-Effect Devices
(PDF)
Improving Batwing Power Dissipation
(PDF)
Procedure for Measuring Pad-to-Ambient Thermal Resistance (R
θPA
) for Exposed Pad Packages
(PDF)
Soldering Methods for Allegro's Products — SMD and Through-Hole
Thermal Design for Plastic Integrated Circuits
(PDF)
Wettable Flank Plated PQFN
Guidelines for Leadforming Using Back-Biased Hall-Effect Devices
