Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of Allegro’s product can reasonably be expected to cause bodily harm.
The small geometries of the BiCMOS process allow these devices to be provided in ultrasmall packages. The package styles available provide magnetically optimized solutions for most applications. Package LH is an SOT23W, a miniature low-profile surface-mount package, while package UA is a three-lead ultramini SIP for through-hole mounting. Each package is lead (Pb) free, with 100% matte tin plated leadframes.
Device | A110x Characteristics | ||||||
---|---|---|---|---|---|---|---|
BOP | BRP | Hys | |||||
Legacy | Replacement | Min | Max | Min | Max | Min | Max |
3141 | A1101 | 30 | 175 | 10 | 145 | 20 | 80 |
3142 | A1102 | 115 | 245 | 60 | 190 | 30 | 80 |
3143 | A1103 | 205 | 355 | 150 | 300 | 30 | 80 |
3144 | A1104 | 35 | 450 | 25 | 430 | 20 | - |
3121 | A1106 | 260 | 430 | 160 | 330 | 70 | 140 |