The ARG81402 is designed to provide power to loads such as microprocessors, sensors, and communication transceivers, and is ideal for both Automotive and Industrial applications.The device is in a small footprint 5x5mm package, and offers a high level of integration, including:
The ARG81402 is supplied in a low-profile 32-lead, 5 mm × 5 mm, 0.5 mm pitch QFN package (suffix “ET”) with exposed thermal pad and wettable flank to allow solder joint inspection.
| Part Number | Package Type | Temperature | RoHS Compliant |
Part Composition / RoHS Data |
Comments | Samples | Check Stock |
|---|---|---|---|---|---|---|---|
| APEK81402KET-01-MH | DEMO BOARD | -20°C to 85°C | No | -- | Contact your local sales rep |
Check Distributor Stock |
|
| ARG81402KETATR | 32-lead QFN | -40°C to 150°C | Yes | View Data | Contact your local sales rep |
Check Distributor Stock |
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of Allegro’s product can reasonably be expected to cause bodily harm.
The ARG81402 is supplied in a low-profile 32-lead, 5 mm × 5 mm, 0.5 mm pitch QFN package (suffix “ET”) with exposed thermal pad and wettable flank to allow solder joint inspection.
